Printed circuits - Import export

Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid

Our services •Layout creation •Material procurement •SMD assembly •Manual and semi-automatic •Mounting •Reflow and wave soldering •Selective soldering •Automatic Optical Inspection (AOI) •X-ray inspection •System assemblies •In circuit tests and •Function test •Revision and repair •Rework Station •Short delivery times

Technical data •Max. Panel size up to 1500mm x 670mm •PCB thickness from 0.1-17.5mm •Smallest hole 0.075mm •Smallest trace/spacing 50µm •Copper layer up to 1000µm •Number of layers up to 58 •Aspect Ratio 20:1 •Rigid flex and flex •Viaplugging •Impedance control •Laser Microvias •Blind, Buried Vias Basic material •FR4, FR4 High TG, FR4 •halogen-free, CEM1/3, Rogers, •Ceramic (Al2O3), polyimide and others Surface •HAL lead-free, HAL Pb/Sn, chem. Ni/Au (ENIG), chem. Ni/Pd/Au (ENEPIG), chem. Sn, chem. Ag, OSP(Entek), galv. Ni/Au, Carbon, Ag/Pt (thick film technology) and others Solder resist and placement printing •Different paint systems (including halogen-free) and colors Standards •ISO 9001:2015 / IATF 16949 •UL listing •RoHS / REACH •Manufacturing according to IPC A600 class 2 and 3 Delivery times •Rush service from 1 AT •Series from 10 AT Data preparation •Legacy document preparation •Scan Service •Data conversion •CAM data preparation •CAD layout service

Tin billets and pellets for foundries

PCB depanelization is a process step in the production of large-scale assembly of electronics. To increase the throughput of printed circuit board (PCB) and surface mount (SMT) production lines, printed circuit boards are often designed to consist of many smaller individual printed circuit boards that will be used in the final product. This PCB cluster is called a panel or multi-block. The large panel is broken or "depanellated" as a process step - depending on the product, this can be right after the SMT process, after the in-circuit test (ICT), after soldering through-hole components, and even just before the final assembly of the PCBA in the enclosure.

KDTech offers comprehensive solutions in electronics production, specializing in SMT and THT assembly, testing, and protective coating applications. They emphasize high-quality production facilitated by a modern machinery park and adherence to ESD safety standards. For purchasing components, they provide tailored solutions and favorable trading conditions thanks to their deep knowledge of the global electronics market. Interested parties are encouraged to contact them directly through their website to discuss specific needs and services.

We have a modern machine park that allows us to professionally complete orders and work safely, quickly and efficiently. Production takes place while maintaining all aspects of ESD protection.

The main pillar of our activity is SMD surface mounting and THT through-hole mounting in compliance with applicable ESD safety standards on high-end equipment

KDTech offers comprehensive solutions in electronics production, specializing in SMT and THT assembly, testing, and protective coating applications. They emphasize high-quality production facilitated by a modern machinery park and adherence to ESD safety standards. For purchasing components, they provide tailored solutions and favorable trading conditions thanks to their deep knowledge of the global electronics market. Interested parties are encouraged to contact them directly through their website to discuss specific needs and services.

We have a modern machine park that allows us to professionally complete orders and work safely, quickly and efficiently. Production takes place while maintaining all aspects of ESD protection.

Final assembly We perform complex tasks that require specialist skills, precision and accuracy in action to deliver the highest quality product in its final stage

Testing/Protective Coatings To complement our capabilities, we offer additional services closely related to production, including testing of finished products and applying protective coatings

The main pillar of our activity is SMD surface mounting and THT through-hole mounting in compliance with applicable ESD safety standards on high-end equipment

We have a modern machine park that allows us to professionally complete orders and work safely, quickly and efficiently. Production takes place while maintaining all aspects of ESD protection.

We have a modern machine park that allows us to professionally complete orders and work safely, quickly and efficiently. Production takes place while maintaining all aspects of ESD protection.

We have a modern machine park that allows us to professionally complete orders and work safely, quickly and efficiently. Production takes place while maintaining all aspects of ESD protection.

We offer a comprehensive and individual approach to both supplementary and final assembly. Selective painting, encapsulation, enclosure and various forms of packaging.

The main pillar of our activity is SMD surface mounting and THT through-hole mounting in compliance with applicable ESD safety standards on high-end equipment

Our offer is aimed at all those who expect a comprehensive approach to electronics assembly. The latest and best SMT assembly technologies in one place.

Designed to meet the needs of smaller, high performance electronic circuitry. These new gap fillers provide an outstanding heat transfer interface across a range of component heights with minimal compression force. THESE PRODUCTS ALL PROVIDE: • Range of thicknesses from 20 mils to 250 mils • Intrinsically tacky surfaces for excellent self-adhesion • Available with various surfaces (no-stick, fabric) for specific application needs • UL 94 V-0 flame retardancy • Large 24" x 24" sheet sizes for improved die-cutting yield with custom sizes available • Range of compliance and thermal conductivities to fit specific applications

Blue Chip Technology have an in-house team of dedicated engineers with a wealth of expertise and experience in designing boards for a variety of applications and industries. We excel in compact PCB designs that allow you to incorporate the necessary features into your product.

When you are looking for substrates for electronic circuits with a high thermal conductivity and a low expansion coefficient (CTE), ceramic pcb will be your preferred choice of material. Today ceramics are already widely used as substrates in many microelectronic components and power LED packages and more and more they are replacing entire printed circuit boards reducing complexity in design and manufacturing while increasing performance. Examples are Chip-on-board (COB) modules, High power circuits, proximity sensors, battery drivers for EVs, … .

LTCC (Low Temperature Co-fired Ceramic) is a multilayer capable substrate technology offering excellent RF and microwave performance characteristics. Thanks to its low sintering temperature (around 900°C) allows it to co-fire with highly conductive metals such as silver and gold. It is sometimes referred to as “glass ceramics” because glass is mixed in its main raw material, alumina. Elite Advanced Technologies is one of the few LTCC specialists globally that is producing its own green tape (base material low temperature co-fired ceramics). LTCC is best suited for applications that can take advantage of one or more of the following: Good electrical performance Dimensional and electrical stability under temperature, moisture and mechanical stress 3D capability curved, cavities, channels Effective thermal management with metal loaded vias (>100 W/MK) Hermeticity Matched TCE with semiconductors (Thermal Coefficient of Expansion) Multiple assembly and packaging solutions

Ceramic prined circuit board feature many advantages over metal core and FR4 circuit boards as they combine excellent thermal characteristics with low a expansion. They are also suitable for multilayer applications, show lower deformation, warpage and operate under higher temperatures. Elite advanced technologies is your partner for ceramic substrates and circuit boards. Thanks to our large laser facilities and patented printing technology we are able to accomodate both very tight tolerances as well as high volume production at a high quality.

We can make, test and despatch conventional and double-sided plated through hole (PTH) printed circuit boards within 48 hours of receipt of manufacturing data. Provided we receive the data early enough on day one.

We carry out a full cycle of development of electronic devices: supply of electronic components, stencils and printed circuit boards, design of electronics, redesign of finished devices. Applying the principles of lean production, we achieve a price reduction while maintaining a high quality of services. Due to quality control at all stages of production, we have the reject rate less than 0.5% (at observance of all requirements to the order). Operative daily planning allows us to achieve maximum efficiency in the use of working time. Thanks to that, in the presence of all the equipment in the warehouse, we can take the order to work during the day from the moment of order. We have our own high-tech equipment, and offering good quality with competitive assembly cost.

SMT and THT assembly with automatic lines. IPC Class 1-2-3 products.

Origin: China Model Number: JXFPC Min. Hole Size: 0.20mm Materials: PI/PET Type: FPC Layers: 1-6 Finished surface: OSP/ENIG Board thickness: 0.2mm Solder mask color: orange Certificate: ISO9001 Copper weight: 1 OZ Base Material: PI/PET Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.20mm Min. Line Width: 0.1mm/4mil Min. Line Spacing: 0.1mm/4mil Surface Finishing: OSP/ENIG Supply Ability: 3000 Square Meter/Square Meters per Month Packaging Details: packing with anti-static red/white bubble Port: Xiamen

BASED ON POLYIMIDE FILM COATED WITH A SPECIAL SURFACE CONDUCTIVE ADHESIVE. STATIC GENERATION DURING ROLL UNWIND AND TAPE APPLICATION IS ELIMINATED. IT CAN WITHSTAND WAVE SOLDER TEMPERATURES UP TO 300C AND LEAVES NO ADHESIVE RESIDUE ON PRINTED CIRCUIT BOARDS UPON REMOVAL.