We carry out a full cycle of development of electronic devices: supply of electronic components, stencils and printed circuit boards, design of electronics, redesign of finished devices. Applying the principles of lean production, we achieve a price reduction while maintaining a high quality of services. Due to quality control at all stages of production, we have the reject rate less than 0.5% (at observance of all requirements to the order). Operative daily planning allows us to achieve maximum efficiency in the use of working time. Thanks to that, in the presence of all the equipment in the warehouse, we can take the order to work during the day from the moment of order. We have our own high-tech equipment, and offering good quality with competitive assembly cost.
KDTECH SP. Z O.O.
Poland
Our offer is aimed at all those who expect a comprehensive approach to electronics assembly. The latest and best SMT assembly technologies in one place.
Request for a quoteOPTIMEL SCHMELZGUSSTECHNIK GMBH
Germany
Optimel is your reliable partner for solutions for encapsulating electrical and electronic assemblies. The innovative Low Pressure Moulding (LPM) technology offers optimal protection against external influences such as moisture, dust and vibrations, thus ensuring the longevity and reliability of your products. The Low Pressure Moulding process or hotmelt moulding process originated in the sealing of cable harnesses in the automotive industry - today it is used in many areas for the protection of electrical and electronic components. At 5-40 bar (in individual cases up to max. 60 bar), processing takes place at a much lower pressure than in the classic hotmelt injection moulding process. This makes it easy to directly encapsulate even sensitive components such as circuit boards, sensors, etc. The cycle times are limited to pure encapsulation
Request for a quoteXIAMEN NINESUN IMP. & EXP. CO., LTD
China
Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid
Request for a quoteBERATRONIC GMBH
Germany
Our services •Layout creation •Material procurement •SMD assembly •Manual and semi-automatic •Mounting •Reflow and wave soldering •Selective soldering •Automatic Optical Inspection (AOI) •X-ray inspection •System assemblies •In circuit tests and •Function test •Revision and repair •Rework Station •Short delivery times
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