Probe cards - Import export

Contacting WLCSP, SiP or flipchip wafers requires probe cards that can tolerate high currents while ensuring high signal integrity. The FeinProbe® addresses these applications perfectly.

Probe card with lamella contact elements, especially suitable for RF applications with a high design variety.

MµProbe® probe cards are characterized by MEMS contact elements and are particularly suitable for fine pitch full array applications in wafer test.

Adaptable to an enormous range of applications, the ViProbe® is a proven buckling beam technology for more than 25 years, valued above all for its uniquely easy reparability.

New version of vertical contact technology with focus on increased service life and other advantages.

Reliable Opto-Electronic Characterization for DC and RF Values The opto-electronic test station NanoTest PIC HD complies with all requirements for the testing of high-density photonics integrated circuits, such as silicon photonics structures or active PICs. Probe cards with up to several hundreds of contacts provide the connection for DC and RF measurements.