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Germany
The Loresta GX is used to measure conductors and semiconductors in the lower resistance range. Measuring range: 10^-4 – 10^7 Ω. It is used to measure the surface resistivity (Ω / □), the volume resistivity (Ω · cm), electrical conductivity (S / cm) in the low-resistance range. The Loresta-GX works according to the 4-pin measuring method. The method is based on the four-wire method and was developed to eliminate the influence of contact resistance. The measuring heads consist of four needle-like electrodes. To simplify the measurement method and calculate the correction factors, all four electrodes are at an equidistant distance from each other. Conductive Materials: Paints, pastes, paints, printing ink, Smart Textiles, Plastics, rubber Film materials, metallic thin films, metallised films, resistor pastes amorphous silicon / silicon wafer, antistatic materials, EMC shielding materials ...
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Thickness range: 12-75 µm Biaxially oriented PP Optics: transparent, opaque, white, matt, glossy, metallisation on request e.g.: TI-Films, Treofan, Propafilm® Application: Food Industry, Electrical Industry, Release, Graphic Arts Industry, Pharmaceutical Industry & Healthcare, Engineering Use, Lamination, Packing
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It is a specially formulated water-based high gloss varnish suitable for application via rollers in-line or through the refill ink reservoir. Properties: High gloss High crazing resistance High rub resistance Application: Recommended for use on most coated paper and boards substrates. Always test for low porosity substrates such as metallised boards, plastics, or films. For uncoated papers/board, and papers below 115 g/m2 suitability can vary depending on application.
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Laser ablation technology helps the engineer to develop circuit carriers which cannot be manufactured with chemical etching technology. This kind of product results from combining the technologies of precision-grinding of ceramics and laser ablation of metallised thin-film layers. We name this concept "three-dimensional interconnection circuit or CI3D". Principle The laser structuring consist to etch directly a metallization layer deposited on a ceramic carrier with a laser beam without using a mask. This is called laser micromachining or laser ablation - because metal is ablated. Laser ablation allows patterns to be etched directly on the ceramics substrate, very rapidly and beam displacements to be programmed limitless. Equipment Solid-state lasers are mostly used for micromachining applications because they feature precision, speed and selective etching. We currently use a Nd :YAG laser with 60 W output. It enables us to etch thin-film metallised layers with thickness of up...
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