Metallised film - Import export

The Loresta GX is used to measure conductors and semiconductors in the lower resistance range. Measuring range: 10^-4 – 10^7 Ω. It is used to measure the surface resistivity (Ω / □), the volume resistivity (Ω · cm), electrical conductivity (S / cm) in the low-resistance range. The Loresta-GX works according to the 4-pin measuring method. The method is based on the four-wire method and was developed to eliminate the influence of contact resistance. The measuring heads consist of four needle-like electrodes. To simplify the measurement method and calculate the correction factors, all four electrodes are at an equidistant distance from each other. Conductive Materials: Paints, pastes, paints, printing ink, Smart Textiles, Plastics, rubber Film materials, metallic thin films, metallised films, resistor pastes amorphous silicon / silicon wafer, antistatic materials, EMC shielding materials ...

Thickness range: 12-75 µm Biaxially oriented PP Optics: transparent, opaque, white, matt, glossy, metallisation on request e.g.: TI-Films, Treofan, Propafilm® Application: Food Industry, Electrical Industry, Release, Graphic Arts Industry, Pharmaceutical Industry & Healthcare, Engineering Use, Lamination, Packing

It is a specially formulated water-based high gloss varnish suitable for application via rollers in-line or through the refill ink reservoir. Properties: High gloss High crazing resistance High rub resistance Application: Recommended for use on most coated paper and boards substrates. Always test for low porosity substrates such as metallised boards, plastics, or films. For uncoated papers/board, and papers below 115 g/m2 suitability can vary depending on application.

Laser ablation technology helps the engineer to develop circuit carriers which cannot be manufactured with chemical etching technology. This kind of product results from combining the technologies of precision-grinding of ceramics and laser ablation of metallised thin-film layers. We name this concept "three-dimensional interconnection circuit or CI3D". Principle The laser structuring consist to etch directly a metallization layer deposited on a ceramic carrier with a laser beam without using a mask. This is called laser micromachining or laser ablation - because metal is ablated. Laser ablation allows patterns to be etched directly on the ceramics substrate, very rapidly and beam displacements to be programmed limitless. Equipment Solid-state lasers are mostly used for micromachining applications because they feature precision, speed and selective etching. We currently use a Nd :YAG laser with 60 W output. It enables us to etch thin-film metallised layers with thickness of up...