Wafers - Import export

Package Quantity : 12 x 700g Artikel Nr: 68205 Grams: 700g

The DW292 is specifically designed for cutting monocrystalline silicon ingots up to 300mm diameter into high quality wafers for the semiconductor industry. The newly developed DW292-300 can be operated with slurry wire, as well as with diamond wire, and has sophisticated features for optimizing warp and ripple. The longer wire field, as well as the higher wire speed and acceleration, enable a higher throughput per machine and year. The use of extremely thin wire is possible thanks to smaller inertia of moving parts, fewer deflection rollers and shorter wire distance. The DW292-300 is highly resistant to temperature fluctuations and vibrations due to its compact and robust machine frame made of mineral casting. Thanks to higher process automation and the new intuitive HMI with dialog-based production wizard, operation is safer, easier and faster.

New version of vertical contact technology with focus on increased service life and other advantages.

thicknessGAUGE C.LP sensor systems use laser profile scanners for the thickness measurement. These scanners project a laser line onto the surface to be measured. The laser line compensates for strip tilting and enables profile averaging. The laser line measuring technique makes it possible to measure the thickness of structured materials such as embossed surfaces and perforated plates.

The IC2001/USB single-channel converter cable is used for the USB connection of optical sensors equipped with an RS422 interface. The cable is easy to install and can therefore be used in machines and facilities.

Contacting WLCSP, SiP or flipchip wafers requires probe cards that can tolerate high currents while ensuring high signal integrity. The FeinProbe® addresses these applications perfectly.

The IMS5420 is a high-performance white light interferometer for non-contact thickness measurement of monocrystalline silicon wafers. The controller has a broadband superluminescent diode (SLED) with a wavelength range of 1,100 nm. This enables the thickness measurement of undoped, doped and highly doped SI wafers with only one measuring system. The IMS5420 achieves a signal stability of less than 1 nm. The thickness can be measured from a distance of 24 mm.

MµProbe® probe cards are characterized by MEMS contact elements and are particularly suitable for fine pitch full array applications in wafer test.

granite base in portal design incident light tube with lens turret vacuum waferchuck

Wafer type Butterfly valve ZIVA-Z - PN6/10/16 with worm gear Use: For drinking water and gas installations

Wafer type Butterfly valve ZESA - PN6/10/16 with worm gear Use: For cold, warm, hot, water and drinking water ...

The Bimor's driving force, the bimorph, comprises two parallel piezoelectric wafers. Their nature is to expand or contract depending on the direction of the voltage. Therefore, when an alternating current is applied, one wafer expands then contracts while the other contracts then expands, causing the biomorph to bend. Repeating the cycle creates a pumping action, as the diagram below shows.

With the LeviWafer-Gripper Transport system it is possible, to lift and transport sensitive Wafers contactless. In combination with the transport, (un)loading of stacks and cassettes is also possible. The gripper uses ultrasonic bearing technology to keep the wafer at a distance, thus enabling contactless transport. In addition to micro-scratches and -cracks, contamination by particles is avoided since without compressed air no air turbulence is created. Therefore, the gripper is also very suitable for clean rooms. The LeviWafer-Gripper can be designed with a single or double paddle. Features of the LeviWafer-Gripper: - Contactless pickup - No micro-scratches, micro-cracks, or particles - Suitable for standard cassettes - Low energy consumption - Customizable according to customer specifications

The modular Waferhandling-System facilitates all possible handling processes of wafers. Loading and unloading, conveying, gripping, inspecting, sorting and singulating can be realized in one system. Our Ultrasonic Suspension Technology keeps the wafer on distance the whole time and therefore prevents micro-scratches and contamination. Features of the Modular Waferhandling-System: - Modular Design - Contactless transport - Customizable according to customer specifcations - Linking various processes in one system

The LeviSolar-Gripper enables contactless gripping and depositing of solar wafers. Our technology guarantees the ultragentle and ultra-clean handling of the sensitive surfaces. When gripping the wafer, a combination of vacuum and ultrasound is used. The vacuum provides the attraction of the wafer and the ultrasound keeps the workpiece, with its repelling effect, at distance. Thus, no points of contact occur between the wafer and the gripper, and gentle handling is ensured. The LeviSolar-Gripper is available for different wafer sizes. The edge stops support the wafer to center itself and to stay in position. Features of the LeviSolar-Gripper: - Contactless overhead lifting - No carry-over of impurities and no micro scratches - No need for compressed air

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

The Peter Wolters AC 2000 double-sided batch processing machine is designed for high-precision series production of workpieces. Thanks to its modular design, the AC 2000 can be used as a fine grinding, lapping, honing and polishing machine. Like all machines in the microLine© series, the AC 2000 relies on proven core components such as the high-precision pneumatic loading system, the non-contact micro-measurement control, the powerful drive technology and the PC-supported machine guidance. The software used for this is specially developed by Peter Wolters and enables complete menu-driven and intuitive operation of the machine. For optimum access to the working area, the entire upper part of the machine can be swung out.

Our radiator valves DIN 42560 type B and type B OR for transformers are designed to be mounted between two flanges or between tank wall flange and radiator flange. The flange is made of forged steel S355J2G3 and thus not subject to any leakage. Flange thickness is h=40 mm with recessed body. Our radiator valves DIN 42560 B and B OR NW 80 fulfill the tightness requirements and operating conditions in accordance with DIN 42560 as well as EN 50216-8. Due to the metal sealed clap a low leakage is permitted while the soft-sealed radiator valve is absolutely oil and vacuum-tight (zero-leakage). Both variations are absolutely tight in operation condition to the outside of the transformer.