The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.
United Kingdom
Like oxides and nitrides, Silicon Carbide (SiC) is a very hard-wearing material, again requiring diamond-grinding methods to process once fired. Although not exclusively, carbides are used mainly for applications in which physical wear is a major consideration. They are amongst the hardest materials available.
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Technical Line Cutting Twist Metal Processing San. Tic. Ltd. Ltd. has created various designs since 2006. It has become indispensable for companies by adding innovations, different perspectives and various solutions to its designs with each passing year.
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The nuclear sector is one which requires extreme precision as well as the ultimate discipline. This also includes machining of course. STEEC provides the players in this sector high-tech subcontracting solutions in micro-drilling or conventional micro-machining and laser micro-cutting. Major French and European companies in the nuclear sector put their trust in STEEC for the manufacture of micromechanical parts.
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Knight Optical’s Laser Optics range include Thin Film Polarisers which separate the s- and p-polarised light with negligible absorbance within the coating for low loss performance. The laser thin film polarisers are optimised for 515nm and 1030nm design wavelengths, ideal for Ytterbium (Yb) doped lasers including diode-pumped solid-state lasers (DPSSL) and fiber lasers, as well as Nd:YAG lasers emitting at 1064nm. Currently, we stock thin film polarisers which work at either 45° or at Brewster angle (55.4°), both of which have been coated using ion beam sputtered (IBS) technology, creating a compact and durable coating, with a LIDT suited for ultrafast laser applications. Often used within a laser resonator to separate the different polarisation states and can be used as an alternative to polarising beamsplitter cubes or Glan-type polarising prisms. The following are the tolerances for the laser polarisers:
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