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We offer laser direct structuring (LPKF-LDS process) for the production of 3D-MID (so-called three-dimensional circuit carriers) as a service in Magdeburg. 3D-MID stands for Mechatronic Integrated Device (or Molded Interconnected Devices). The MID technology makes it possible to use three-dimensional plastic parts as circuit carriers for electronic or mechatronic assemblies. The LPKF-LDS process is one of the technologically leading and at the same time most economically interesting process for the production of 3D-MID. The LPKF LDS process represents the central process step. The process was developed and patented by the company LPKF Laser & Electronics AG in Hanover.
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