Laser Direct Structuring (Lpkf Lds Procedure)

Mechatronic integrated devices or molded interconnect devices (injection-molded circuit carriers) are spatial electronic assemblies – so-called 3D-MID. A special process is used to apply metallic conductor tracks to a specific substrate material (often plastic), thus creating three-dimensional assemblies that also serve as circuit carriers. These spatial electronic assemblies are manufactured using 3D-MID technology and, compared to conventional assemblies, enable the integration of electronic, mechanical, fluidic, optical and thermal functions. The resulting additional benefits represent advantages that cannot be realized with two-dimensional circuit carriers (printed circuit boards).

We are specialized in performing thermal shock testing of electronic and mechanical assemblies and have a lot of experience with the requirements of the automotive industry and medical technology. On behalf of our customers, we perform environmental and climatic tests according to customer specifications and applicable standards, thus uncovering optimization potential. We will be happy to advise you with regard to your testing tasks and, together with you, transfer the entire testing process into a specification sheet. OUR OPPORTUNITIES 2-chamber system air-air Test chamber volume up to 130 liters Temperature range hot chamber 50°C to 200°C Temperature range cold chamber -80°C to -100°C Change between chambers <15 seconds Maximum test material weight 25 kg State monitoring of the test specimens during the test

In an environmental simulation, assemblies are subjected to defined environmental conditions to validate their behavior under those conditions. The variables of an environmental simulation test include climatic aspects such as temperature (cold, heat), the air conditions (humidity, wetness), mechanical influences such as dust, vibration, vibration or impacts, and corrosive environmental effects such as salty lift (salt fog). As an environmental simulation laboratory, we simulate these environmental conditions in our climatic chambers and climatic chambers, creating real conditions to investigate the long-term behavior of the test specimens in reality. Environmental simulation and thermal shock testing laboratory for electronic assemblies and printed circuit boards We specialize in performing environmental simulation and temperature shock testing of electronic and mechanical assemblies. With over ten years of experience with the requirements of the automotive industry and medical

We are specialist in strain gage strain measurements on printed circuit boards and all other components. We carry out the application of strain gages and determine for you the actual stresses that occur, or the strain (also strain-rate) on a specific or several components in the manufacturing or assembly process. We perform our DMS measurements with certified measurement technology and according to the specifications of IPC/JEDEC-9704A. Expert advice from TEPROSA When measuring strain, in addition to many factors such as the appropriate measurement technology, it is also important to rperform the strain measurement correctly and to ensure that the sensors record the forces correctly. To ensure that the deformation of an object is correctly determined, it is therefore crucial to select the right strain gauges (also known as measuring strips) and to place them in the correct position on the measured object.