Silicone material - Import export

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.