Prototyping - Import export

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Hot air leveling (HAL-leadfree) SMD hole spacing 1.27 x 1.27 mm 113 x 76 soldering pads 1.00 x 1.00 mm (8588 soldering pads) Hole diameter 0.35 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Sn SMD hole spacing 1.27 x 1.27 mm 108 x 69 soldering pads 1.00 x 1.00 mm (7452 soldering pads) 4 potential strips Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

Epoxy fibre-glass FR4 0.80 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Sn SMD hole spacing 1.27 x 1.27 mm 40 x 60 soldering pads 1.00 x 1.00 mm Hole diameter 0.35 mm 2 grids 2.54 x 2.54 mm (1/20") 17 x 32 and 18 x 32 soldering pads 2.00 x 2.00 mm Hole diameter 1.00 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

Epoxy fibre-glass FR4 0.80 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Sn SMD hole spacing 1.27 x 1.27 mm 39 x 59 soldering pads 1.00 x 1.00 mm Hole diameter 0.35 mm Size 53 x 95 mm

Epoxy fibre-glass FR4 0.80 mm Double-sided 35 µm Cu Plated through holes (PTH) Hot air leveling (HAL-leadfree) SMD hole spacing 1.25 x 1.25 mm 40 x 60 soldering pads 1.00 x 1.00 mm Hole diameter 0.35 mm Size 53 x 95 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 38 x 61 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

Fibre-glass CEM3 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 38 x 61 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Surface with solder stop mask Hole spacing 2.00 x 2.00 mm 44 x 42 soldering pads 1.60 x 1.60 mm Hole diameter 1.00 mm Working temperature max. 150 °C Soldering bath proof: 260 °C > 50 sec. Size 90.17 x 95.89 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.50 x 2.50 mm 37 x 58 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Connector 31-channel DIN 41617 Size 100 x 160 mm

SRBP-paper FR2 1.50 mm Single-sided 35 µm Cu Organic soldering protection (OSP) Hole spacing 2.50 x 2.50 mm 37 x 58 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Connector 31-channel DIN 41617 Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.50 x 2.50 mm 37 x 62 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

SRBP paper FR2 1.50 mm Single-sided 35 µm Cu Organic soldering protection (OSP) Hole spacing 2.50 x 2.50 mm 37 x 62 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 37 x 56 soldering pads 2.10 mm Ø Hole diameter 1.00 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

SRBP paper FR2 1.50 mm Single-sided 35 µm Cu Organic soldering protection (OSP) Hole spacing 2.54 x 2.54 mm 37 x 56 soldering pads 2.10 mm Ø Hole diameter 1.00 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

DIL-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 37 x 38 soldering pads 2.00 x 2.00 mm Hole spacing 2.54 x 2.54 mm Hole diameter 1.00 mm Size 100.97 x 99.06 mm

DIL-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 25 x 25 soldering pads 2.00 x 2.00 mm Hole spacing 2.54 x 2.54 mm Hole diameter 1.00 mm Size 67.94 x 68.58 mm

DIL-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 14 x 14 soldering pads 2.00 x 2.00 mm Hole spacing 2.54 x 2.54 mm Hole diameter 1.00 mm Size 40.00 x 40.50 mm

SMD-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) Solder stop mask 51 x 52 soldering pads 1.00 x 1.00 mm Hole spacing 1,27 x 1,27 mm Hole diameter 0.45 mm Size 70.48 x 68.58 mm

SMD-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 27 x 27 soldering pads 1.00 x 1.00 mm Hole spacing 1,27 x 1,27 mm Hole diameter 0.45 mm Size 39.37 x 38.10 mm

SRBP paper FR2 1.50 mm No Cu Hole spacing 2.54 x 2.54 mm 38 x 61 holes with 1.00 mm Ø Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Without holes Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Size 100 x 160 mm