Prototyping - Import export

Milling of complex components for automotive and mechanical engineering. Production of prototypes, test parts, small and large series according to data records, drawings, samples or specifications. Machining of cast and forged blanks. Attachment of decorative surfaces.

Thanks to our expertise in mechanical production, we can provide you with effective support in the purchase and procurement of: supplier parts Prototypes Experimental parts Rapid prototypes Sample parts You can obtain these parts directly from us from our supplier network, or we will support you in procuring them from your suppliers by coordinating your development, purchasing, logistics and quality assurance.

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Hot air leveling (HAL-leadfree) SMD hole spacing 1.27 x 1.27 mm 113 x 76 soldering pads 1.00 x 1.00 mm (8588 soldering pads) Hole diameter 0.35 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Sn SMD hole spacing 1.27 x 1.27 mm 108 x 69 soldering pads 1.00 x 1.00 mm (7452 soldering pads) 4 potential strips Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

Epoxy fibre-glass FR4 0.80 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Sn SMD hole spacing 1.27 x 1.27 mm 40 x 60 soldering pads 1.00 x 1.00 mm Hole diameter 0.35 mm 2 grids 2.54 x 2.54 mm (1/20") 17 x 32 and 18 x 32 soldering pads 2.00 x 2.00 mm Hole diameter 1.00 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

Epoxy fibre-glass FR4 0.80 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Sn SMD hole spacing 1.27 x 1.27 mm 39 x 59 soldering pads 1.00 x 1.00 mm Hole diameter 0.35 mm Size 53 x 95 mm

Epoxy fibre-glass FR4 0.80 mm Double-sided 35 µm Cu Plated through holes (PTH) Hot air leveling (HAL-leadfree) SMD hole spacing 1.25 x 1.25 mm 40 x 60 soldering pads 1.00 x 1.00 mm Hole diameter 0.35 mm Size 53 x 95 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Surface with solder stop mask Hole spacing 2.00 x 2.00 mm 44 x 42 soldering pads 1.60 x 1.60 mm Hole diameter 1.00 mm Working temperature max. 150 °C Soldering bath proof: 260 °C > 50 sec. Size 90.17 x 95.89 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 38 x 61 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

Fibre-glass CEM3 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 38 x 61 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.50 x 2.50 mm 37 x 58 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Connector 31-channel DIN 41617 Size 100 x 160 mm

SRBP-paper FR2 1.50 mm Single-sided 35 µm Cu Organic soldering protection (OSP) Hole spacing 2.50 x 2.50 mm 37 x 58 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Connector 31-channel DIN 41617 Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.50 x 2.50 mm 37 x 62 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

SRBP paper FR2 1.50 mm Single-sided 35 µm Cu Organic soldering protection (OSP) Hole spacing 2.50 x 2.50 mm 37 x 62 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 37 x 56 soldering pads 2.10 mm Ø Hole diameter 1.00 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

SRBP paper FR2 1.50 mm Single-sided 35 µm Cu Organic soldering protection (OSP) Hole spacing 2.54 x 2.54 mm 37 x 56 soldering pads 2.10 mm Ø Hole diameter 1.00 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

DIL-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 37 x 38 soldering pads 2.00 x 2.00 mm Hole spacing 2.54 x 2.54 mm Hole diameter 1.00 mm Size 100.97 x 99.06 mm

DIL-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 14 x 14 soldering pads 2.00 x 2.00 mm Hole spacing 2.54 x 2.54 mm Hole diameter 1.00 mm Size 40.00 x 40.50 mm

SMD-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 75 x 75 soldering pads 1.00 x 1.00 mm Hole spacing 1,27 x 1,27 mm Hole diameter 0.45 mm Size 99.06 x 99.69 mm

SMD-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) Solder stop mask 51 x 52 soldering pads 1.00 x 1.00 mm Hole spacing 1,27 x 1,27 mm Hole diameter 0.45 mm Size 70.48 x 68.58 mm

SMD-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 27 x 27 soldering pads 1.00 x 1.00 mm Hole spacing 1,27 x 1,27 mm Hole diameter 0.45 mm Size 39.37 x 38.10 mm

SRBP paper FR2 1.50 mm No Cu Hole spacing 2.54 x 2.54 mm 38 x 61 holes with 1.00 mm Ø Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Without holes Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Size 100 x 160 mm

We offer highquality prototypes for industrial product development. Our inhouse design team will work along with you to define the best material and integration.