SMD-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) Solder stop mask 51 x 52 soldering pads 1.00 x 1.00 mm Hole spacing 1,27 x 1,27 mm Hole diameter 0.45 mm Size 70.48 x 68.58 mm
Germany
Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Size 100 x 160 mm
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Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 38 x 61 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm
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Fibre-glass CEM3 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 38 x 61 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm
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Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Surface with solder stop mask Hole spacing 2.00 x 2.00 mm 44 x 42 soldering pads 1.60 x 1.60 mm Hole diameter 1.00 mm Working temperature max. 150 °C Soldering bath proof: 260 °C > 50 sec. Size 90.17 x 95.89 mm
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