Electronic assemblies - Import export

Dymax GA201 forminplace (FIP)/cureinplace (CIP) gasketing resin is formulated for sealing plastic, glass and metal enclosures, and plated surfaces for automotive door handle, appliance housing, and critical electronic assembly and device applications which require a soft, tackfree, flexible gasket. Features: - Cures with UV/Visible light - Moisture resistant - Chemical resistant - Tackfree cure - Soft, durable after complete cure - Conforms to intricate channels and recesses - Compliant with RoHS directives 2015/863/EU

Dymax GA140 forminplace (FIP) and cureinplace (CIP) gasketing resin is formulated for fuel cell, automotive door handle, appliance housing, and critical electronic assembly and device applications which require a soft, tackfree, lowoutgassing, flexible gasket with compression set. Features: - Cures with UV/Visible light - Low outgassing - Cures soft and tack free - Excellent tear resistance - Clear in color - Cures in seconds - Silicone free - Conforms to intricate channels or recesses - Compliant with with RoHS directives 2015/863/EU

Up to 60 rivets per minute! – Endorsed by major customers! GESIPA® speed rivets are a cost-effective alternative to automation. Speed rivet technology is a joining method that requires access from only one side and which enables fast cycle times thanks to the preloaded rivets and automatic feed. Advantages • Large grip range • Reduced variation • Optimum hole filling capabilities and bearing stress • Ideally suited for transferring shear strengths with moderate clamping force • Ideal for: — LED light strips — Electronic/pcb assembly — Lightweight sheet metal structures — PC housings — Rating plates — Blind holes