Dymax GA201 forminplace (FIP)/cureinplace (CIP) gasketing resin is formulated for sealing plastic, glass and metal enclosures, and plated surfaces for automotive door handle, appliance housing, and critical electronic assembly and device applications which require a soft, tackfree, flexible gasket. Features: - Cures with UV/Visible light - Moisture resistant - Chemical resistant - Tackfree cure - Soft, durable after complete cure - Conforms to intricate channels and recesses - Compliant with RoHS directives 2015/863/EU
DYMAX EUROPE GMBH
Germany
Dymax GA140 forminplace (FIP) and cureinplace (CIP) gasketing resin is formulated for fuel cell, automotive door handle, appliance housing, and critical electronic assembly and device applications which require a soft, tackfree, lowoutgassing, flexible gasket with compression set. Features: - Cures with UV/Visible light - Low outgassing - Cures soft and tack free - Excellent tear resistance - Clear in color - Cures in seconds - Silicone free - Conforms to intricate channels or recesses - Compliant with with RoHS directives 2015/863/EU
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Germany
Plating, grit blast, and heatresistant Maskant with SeeCure Technology. Features: - Cures with UV/Visible light - See Cure dispenses blue, cures pink upon cure - Excellent surface protection - Complete under in 8 seconds - Easy peeloff after exposure to heat/hot water bath - Spray or dip application - Rolls Royce approval as metal spray maskant with designation of OMat 2/240 - Compliant with ISO 109935 Cytotoxicity - Compliant with with RoHS2 directives 2015/863/EU
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Germany
Dymax Ultra LightWeld® 9501F is a UV/Visible lightcuring adhesive optimized for electric vehicle battery potting and bonding. Features: - Cure using UV/Visible light or LED - 385 nm LED Curing - Blue Fluorescing technology for bond line inspection - One part formulation – no mixing - Solvent free Excellent adhesion to metals & plastics
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Germany
Dymax Dual-Cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Features: - Cures with UV/Visible light - Dual Cure secondary moisture cure capability - Fluoresces blue under black lights - Flexible
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