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Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for machine assembly (Pick & Place) of Fine-Pitch QFP 256 QFP 256 4 x Size 100 x 140 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm CU Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for 85 solder practices for SMD standard, fine pitch, and discrete components: version quantity PLCC 52, 68, 20 QFP 44, 84, 132, 184 sq. SOT23 3 x SOT89 2 x SOT143 1 x SOT233 1 x SO14 1 x SOM16 1 x SOL20 1 x Poti. 1 x DPAK 1 x Al. Kond. 6.30 mm 1 x Al. Kond. 4.00 mm 1 x Melf 2308 2 x Mini Melf 1206 6 x Tantal Chip Kond. A 1 Tantal Chip Kond. B 1 Tantal Chip Kond. C 1 Tantal Chip Kond. D 1 0402 Chip Kond. 10 x 0603 Chip Kond. 10 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip Kond. 7 x 2220 Chip Kond. 1 x 1812 Chip Kond 2 x TSOP32 1 x 5020 Schwingquarz 1 x Also very suitable for machine assembly (Pick and Place) Size 100 x 140 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for 57 solder practices for implementation into the SMD surface mounted device: version quantity PLCC 20, 68 QFP 84 sq. TSOP32 1 x SO14 1 x SOM16 1 x SOL20 1 x SOT23 3 x SOT143 1 x SOT89 2 x SOT233 1 x DPAK 1 x Poti. 1 x Tantal Chip Kond. A 1 x Tantal Chip Kond. B 1 x Tantal Chip Kond. C 1 x Tantal Chip Kond. D 1 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip Kond. 6 x 1812 Chip Kond. 2 x 2220 Chip Kond. 1 x 2308 Melf 2 x 1206 Mini Melf 6 x Suitable for Pick & Place PCB for 57 solder practices for implementation into the SMD surface mounted device: version quantity PLCC 20, 68 QFP 84 sq. TSOP32 1 x SO14 1 x SOM16 1 x SOL20 1 x SOT23 3 x SOT143 1 x SOT89 2 x SOT233 1 x DPAK 1 x Poti. 1 x Tantal Chip Kond. A 1 x Tantal Chip Kond. B 1 x Tantal Chip Kond. C 1 x Tantal Chip Kond. D 1 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip...

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Hot Air Leveling (HAL lead free) Solder practice board for 11 different SMD components: 6x SO8 8x SO14 4x SO16w 4x SOT223-3 4x SO20 4x SOT89 22x SOT23 78x 1206 66x 0805 26x 1812 20x 2220 Size: 72.00 x 213.00 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for solder practices for SMD Fine-Pitch QFP 208 QFP 208 4 x For manual soldering and very suitable for machine assembly (Pick & Place) Size 100 x 140 mm

SELECTIO Selective soldering systems for automatic single point soldering and multiple point soldering It is not always possible to use mass soldering processes such as wave soldering to perform a certain soldering task. Individual soldering steps are often necessary. To automate this process and to lower the costs while maintaining the high quality requirements, STRECKFUSS SYSTEMS has developed the selective soldering system SELECTIO. Just like our wave soldering system TITANIUM, SELECTIO too is equipped with the corrosion and tin resistant agent titanium and therefore works perfectly for lead free soldering. Product characteristics – an overview: x/y/z- axes system with precision toothed drive belt transport system and assembly carrier standard stand- alone- system (offline system): optional transportation belt connection as inline system printed circuit board transportation with assembly carrier soldering processes: single point nozzle and surface nozzle as well as dip soldering via mask technique fluxing out of vendor's flux container with multi- drop- fluxer nozzle short wave IR- quartz- radiators for preheating of printed circuit boards pyrometer for contact- free temperature check of printed circuit boards easily exchangeable soldering nozzles Microsoft© Windows user surface and process visualization: - BDE for documentation complying with DIN ISO 9000 ff - management data organization - optional real- time video surveillance

TYP A 040 Solder lug insertion device Description The solder lug insertion device Type A 040 is designed to insert pre- stored solder lugs into p. c. boards. The components are supplied automatically to the device, and will be pressed into the p. c. board by an air cylinder. Therefore, the p. c. board has to be held to the setting position manually, and a tracer finger then triggers the setting process. The inserting device will handle all usual in the trade solder lugs, which are lined up on wire or adhesive tape. Replacing the insertion head and the bin makes it possible, to process solder tags with different dimensions and forms. The re- tooling is easy, and takes only a few minutes. Components

TYP A 040/B Solder lug inserting with tape feeder Description The solder lug inserting device Type A 040 B, was constructed for a mechanised insertion of solder lugs. Fixed cycles of less than one second are within easy reach. A Foot pedal controls the individual stroke sequence. The taped solder lugs are automatically fed into the machine. Therefore, no additional material and wage costs for threading the solder lugs on leads will arise. The device is able to process all kind of taped solder lugs with standard forms. After a slight alternation, solder lug strips, which deviate from standard, can also be processed. To do this, you simply have to replace the insertion head with stripe guide and the cutting tool, which is fast and easy to do. All driving elements and electrical switches belong to the main machine and therefore, they do not have to be moved. The bearing pedestal for the material bin can hold coils up to 500 mm ø. An adjustable conical ring centres the coil on the bearing pedestal. Working with this device is very easy and save. Components

TYP A 040/R Solder lug inserter Description The Streckfuss solder lug inserting device Type A 04 R is designed, to insert solder lugs into p. c. boards. The Solder lugs are automatically moved into the device by a vibrating conveyor. An air cylinder then presses them into the p. c. board. To do this, the p. c. board is to be held manually to the setting position. The setting process by itselve is triggered over an tracer finger. This inserting device is able to process all kind of usual in the trade solder lugs (incl. double tongues), which can be supplied by a conveyor for bulk materilas. Components

TYP A 041 Solder lug inserter Description The device Type A 041 is designed, to insert stored solder lugs (solder posts) into p. c. boards, spool bodys or contact banks. The solder lugs are pressed into the p. c. boards by an Foot pedal- activated air cylinder. The p. c. board is centered by a insertion pin. The device can optionally be equipped with a light point adjustement. All usual in the trade solder lugs which are lined up on wire or adhesive tape can be processed. Retooling to different solder lug forms is possible and easy to do. The p. c. board is placed in the frame and will be adjusted. After that the p. c. board has to be shifted manually into the working area. The setting postion can be placed trough a luminous spot. The insertion itself is triggered by a Foot pedal. Components

TYP A 042 Round pin inserter Description The Streckfuss inserting device Type A 042 offers the economical solution, for the mechanised insertion of round pins, solder posts and or - lugs into p. c. boards. With this device, nearly all customer forms of round pins, solder posts / - lugs can be processed. The loose components are filled into the sorting pot of the vibration conveyor. Trough barriers in the helical of the conveyor, the components are ordered. After positioning, the components are handed to the loading slider, which supplies the components to the inserting tool. Working with this device is save and easy: For assembling, hold the p. c. board with both hands on the edges, and place it under the inserting tool. The p. c. board now lies at the bottom of the pressure stamp, while the tooling pin hole is placed directly under the solder post / - lug shaft looming out of the inserting tool. This has the function of a locating pin. The p. c. board is lifted parallel, so the components shaft enters the tooling pin hole. The insertion process is triggered by a foot switch. Components

ROTONDO Solder bumps brush module LPB- 1000 The solder bumps- brush devices have been developed to remove the solder bumps formed in the soldering process, economically and reproducibly from the bottom of the circuit board. The PCBs are transported by a carrier of goods through the module. This makes it possible to brush without width adjustment different PCB formats with the module. ROTONDO is available in different versions and options. We manufacture batch and in- line systems of different widths.