Solder bumps brush

ROTONDO Solder bumps brush module LPB- 1000 The solder bumps- brush devices have been developed to remove the solder bumps formed in the soldering process, economically and reproducibly from the bottom of the circuit board. The PCBs are transported by a carrier of goods through the module. This makes it possible to brush without width adjustment different PCB formats with the module. ROTONDO is available in different versions and options. We manufacture batch and in- line systems of different widths.