Integrated circuits - Import export

We specialize in engineering high quality composites for management of heat in electronics packages, particularly Integrated Circuit (IC) packaging. These composite materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC). Turnkey Solution for Production Ready Pedestals Our advanced thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging. Sizes Our heat spreader materials for IC packages are offered in a wide breadth of sizes including: Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm) Down to finished machined and plated products in 0.015” (0.381mm) cubes Hermetic Housings and Heat Sinks These thermal management products are used as both the hermetic housings and as the expansion-matched

Our Nickel-Iron alloys are engineered to the ASTM F30 standards for sealing materials and their specified coefficients of thermal expansion. These materials are generally used as the sealing material to bridge the difference between two materials of differing expansion rates during heating and to maintain a hermetic seal. These Nickel-Iron Strip Products are generally used in glass to metal sealing applications ranging from light bulbs to hermetically sealed integrated circuits as well as electrical applications such as switch-gear connections and reed switch systems. Nickel Iron alloys include Invar®, alloys 42, 46, 48 and 52. Others available on request.