We specialize in engineering high quality composites for management of heat in electronics packages, particularly Integrated Circuit (IC) packaging. These composite materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC). Turnkey Solution for Production Ready Pedestals Our advanced thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging. Sizes Our heat spreader materials for IC packages are offered in a wide breadth of sizes including: Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm) Down to finished machined and plated products in 0.015” (0.381mm) cubes Hermetic Housings and Heat Sinks These thermal management products are used as both the hermetic housings and as the expansion-matched
United Kingdom
We offer a Very Wide Range of Brands, please send me enquiry via liamm@merefields.com or enquires@merefields.com
Request for a quoteCzech Rep.
Our four-cylinder rolling machines offer a maximum width of 1900 mm, and pipe twisting up to a diameter of 220mm at max. 6mm gage. In smaller versions 1000mm, for diameter min. 125mm
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