We specialize in engineering high quality composites for management of heat in electronics packages, particularly Integrated Circuit (IC) packaging. These composite materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC). Turnkey Solution for Production Ready Pedestals Our advanced thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging. Sizes Our heat spreader materials for IC packages are offered in a wide breadth of sizes including: Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm) Down to finished machined and plated products in 0.015” (0.381mm) cubes Hermetic Housings and Heat Sinks These thermal management products are used as both the hermetic housings and as the expansion-matched
MEREFIELDS ELECTRONICS LTD
United Kingdom
We offer a Very Wide Range of Brands, please send me enquiry via liamm@merefields.com or enquires@merefields.com
Request for a quoteOREMUS S.R.O.
Czech Rep.
Our work starts with precise and efficient material cutting using modern machines. Our Laser and plasma cutters are available for sheet metal processing of all grades. Laser Trumpf 4kW with interchangeable table 4000x2000mm cuts mild steel of max. 18mm with both oxygen or nitrogen. Plasma Omnicut/Hypertherm where portal is also fitted with an acetylene burner; table size 6500 x 2000mm, usually cuts max. thickness 100mm
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