Electronics - Import export

Contract Manufacturing by SEACOMP Get your concept to physical product with our electronics manufacturing services. Use our engineering team to get your design ready for mass production or let us take your perfectly designed product and build it at scale. We help launch electronic devices for home automation, industrial controls, consumer products, and medical devices. Manufacturing is completed in our wholly-owned China facility that is ISO 13485 certified. Our production capabilities include: - PCB Assembly, Surface Mount (SMT), Through Hole Assembly - Wave Soldering - Reflow Soldering - Plastic Injection Molding (vertical and horizontal) - Ultrasonic Welding - Cable Assembly and Over-Molding We also provide the finished assembly of your product before it is shipped anywhere in the world: - Laser Marking - Pad Printing - UV Ink Curing - Label Printing - UV Light Metering - Box Build Assembly - Bulk or Retail Packaging - Warehousing Contact us to learn more.

We specialize in engineering high quality composites for management of heat in electronics packages, particularly Integrated Circuit (IC) packaging. These composite materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC). Turnkey Solution for Production Ready Pedestals Our advanced thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging. Sizes Our heat spreader materials for IC packages are offered in a wide breadth of sizes including: Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm) Down to finished machined and plated products in 0.015” (0.381mm) cubes Hermetic Housings and Heat Sinks These thermal management products are used as both the hermetic housings and as the expansion-matched

Our highly specialized Spinodal materials are custom-engineered for electronic connectors and deliver major advantages in comparison to traditional materials such as Beryllium Copper (BeCu). We offer precision strip and wire products in alloy Pfinodal® (UNS C72900), a copper nickel tin Spinodal alloy, for the manufacturing of high performance electronic connectors in the electronics industry. Safe Alternative to Beryllium Copper (BeCu) Beryllium Copper (BeCu) materials are the historical choice for electronic connectors. Our high performance Pfinodal® (UNS C72900) delivers similar mechanical properties to Beryllium Copper but without the harmful exposure risks.

We offer two Spinodal alloy grades produced through the same wrought powder metallurgy as copper based products with nickel and tin additions. Our Pfinodal® (C72900) and AM 388® (C72650) spinodal materials deliver similar mechanical properties to Beryllium Copper alloy (C17200) but without the carcinogenic exposure risks. Advantages include: No carcinogenic elements - only copper/nickel/tin Ductile state and heat treatable Electrically conductive Reduced distortion during heat treatment Reduced stress relaxation Safe Alternative to Beryllium Copper (UNS C17200) Recently, Pfinodal® and AM-388® have been chosen as a replacement for Beryllium Copper due to the carcinogenic effects of Beryllium and fears of bans on Beryllium containing products due to REACH, RoHS, and OSHA mandates. Spinodal materials are gaining acceptance in new projects as well as legacy qualifications as manufacturers, OEMs, and consumers reject products