Metal etching - Import export

DPC Ceramic Substrate Advantages: > In terms of shape processing, DPC ceramic substrate needs to be cut by laser, the traditional drilling and milling machine and punch machine can not be accurately processed, so the combination force and line width is also more fine. > The crystal performance of the metal is good; > The flatness is good; > The line is not easy to fall off; > The line position is more accurate, the line distance is smaller, reliable and stable, can be through the hole and other advantages.

Lightweighting, freedom of design and cost reduction are the drivers for every application and sector. For this reason, Silga is increasingly called upon by its Customers to become a partner in the development of solutions that achieve this objective. Especially if they are non-standard solutions. One of the most important and successful is that of FLEXIBLE HEATERS . In this area, in fact, skills related to: Flexible PCB's Alternative materials Chemical etching capability of metals other than copper Know How in using functional inks Exclusive surface finishes developed by Silga. Production lines adequate for the required volumes

Diversity meets experience Surface treating and coating processes are just as numerous as they are diverse. We develop customtailored systems for almost any application, taking into account customer process specifications: Electroplating and chemical coating of metal component Electroplating and chemical coating of plastic components Aqueous cleaning of metal components Cathodic dip coating Electropolishing stainless steel and copper components Etching and staining metal components Etching glass and ceramic

Microelectronic circuits continuously require new packaging technologies. Ceramic substrates are widely used in this field for their good dimension stability, high electrical insulation as well as their resistance to high temperature. But it is now possible to create microelectronic circuits on 3D carriers made with ceramics. This new type of component integrates electrical and mechanical functions on a same carrier, which gives a wider scope in terms of design and integration. Microcertec has developped a unique expertise to manufacture these ceramic 3D interconnection devices - CI3D - based upon high-precision ceramic grinding of a 3D carrier, thin-film metallizing and laser etching. These 3D interconnect carriers demonstrate the advantages of being made with advanced ceramics but they also offer miniaturization capabilities, enhanced reliability and more simple integration stages. In actual fact, the geometry of the carriers offers a 3D arrangement so that microelectronic...

Laser ablation technology helps the engineer to develop circuit carriers which cannot be manufactured with chemical etching technology. This kind of product results from combining the technologies of precision-grinding of ceramics and laser ablation of metallised thin-film layers. We name this concept "three-dimensional interconnection circuit or CI3D". Principle The laser structuring consist to etch directly a metallization layer deposited on a ceramic carrier with a laser beam without using a mask. This is called laser micromachining or laser ablation - because metal is ablated. Laser ablation allows patterns to be etched directly on the ceramics substrate, very rapidly and beam displacements to be programmed limitless. Equipment Solid-state lasers are mostly used for micromachining applications because they feature precision, speed and selective etching. We currently use a Nd :YAG laser with 60 W output. It enables us to etch thin-film metallised layers with thickness of up...

Pickling is chemical etching of metal surfaces using an aggressive, alkaline solution to remove applied metal layers or to get an oxide-free surface (activation of the base metal for further coating). Maximum measurements 4000 x 1000 x 500 mm