Semiconductor - Import export

These are the small and exquisite products,which made by aluminum,after 3-axis machining,then natural anodize.

The T3 system combines smooth operation, low noise, simple assembly, and economy. The side bands, which snap together, replace a conventional pin and bore connection and prevent relative movements between the joints giving extremely low wear. This means virtually no wear or abrasion (cleanroom). The t-band's geometry means that hardly any polygon effect is generated when the energy chain is placed. The t-band therefore rolls in a very smooth arc, giving extremely low vibration and noise. In order to reduce the manufacturing and installation costs, the t-band is not mounted individually, but – much like the E3 system – in an eight-link length. Due to its low mass, the t-band is suitable for applications with low fill weights and short strokes combined with high speeds and accelerations.

Aside from the tried-and-tested uses of the E6, the new generation offers additional advantages which significantly simplify operation. In addition, design changes have improved accessibility to the interior, reduced weight and made assembly easier. - Option without camber (NC) simply by turning the inner link - Extremely quiet due to the small pitch and "brake" in the stop-dog system - (E61.29.070.055.0 at 1m/s = 32dB(A) according to igus internal test 4479) - Extremly low vibration - Low-abrasion connector system (no bolts and holes necessary) - Virtually no polygon effect, thereby "smooth rolling" operation - Smooth interior design for a long lifetime for cables and hoses - E61.29 series: cross bars on both sides can be snapped open and removed along the inner and outer radii - Weight savings approx. 30% compared to the E6 system - Cost-effective

Product model :X-7600 Magnification :200X Detection accuracy :5um The use of the world's top HAMAMATSU Japan X-ray source can easily identify the semiconductor packaging gold wire bending gold wire fracture, large load table, can be placed in a large industrial control board ultra-long LED light bar applicable to various fields of electronic products

Spare parts include for example chambers, filaments, arc slits, holders and many other parts. The pare parts are made of graphite, molybdenum, tungsten and alloys. They are extremely durable and long lasting and therefore save money and maintenance time. 100 or more Plansee components are at work in every beam path. They ensure that the ions are generated efficiently and guided precisely and free from impurities along the beam path to the wafer. For customers in the semiconductor industry, Plansee spare parts are increasingly becoming more than just spares. Taking the equipment manufacturer's original spare parts as starting point, Plansee optimizes the geometries and material compositions. The benefits to you: — Simplified component installation and removal — Longer service lives — Lower cleaning costs — Reduced maintenance work — Reduced downtimes

With its complete array of material and process competencies, NKCG serves all types of semiconductor applications. NKCG has been a reliable partner for semiconductor material producers and device makers for decades, bringing its vast experience to improve processes.

We offer a range of industrial grade fiber optic transmitters and receivers (DC-1/5/10/50 MBd) in the RedLink® connector.

PSL manufacture every type and size of heat sink - including standard extrusion, bonded-fin and liquid cooling plate. We can incorporate fans and embedded pipes, and we provide a full stack assembly service using any type of semiconductor device. Full 3D CAD drawings, thermal simulation graphics, pressure testing, technical advice and consultancy. Prototypes available, volume quantities provided by fixed schedules.

Ultra high purity tungsten alloy W-Ti sputtering target Plate Planar Billet for Semiconductor Physical Vapor Deposition

Aluminium CNC milling part in black anodize finish Tolerance:+/-0.05mm， Critical holes and threads Surface rougness:Ra1.6 CNC Machining parts, Machining in Aluminium stainless steel,brass,copper, titanium,POM and so on. Aluminium housing, Blocks, flanges, valve seat, supporter CNC Turning parts ,Machining in Aluminium stainless steel,brass,copper, titanium,POM and so on.

Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries.

Germanium wafers are a semiconductor material & therefore are a smart choice for microelectronics. Due to its unique electric properties, it is widely used for sensors, solar cells and infrared optical applications. The wafers are also great for microelectronics as the space is limited and being available in 500μm or less it makes it perfect to achieve the high quality results required. It’s thermal conductivity makes it a good alternative to silicon. Our stock wafers are produced as thin as 500μm and provide exceptional surface quality. However, we can manufacture to a fully customised specification with a wafer thickness as little as 10 μm. Typical specifications of our germanium wafers are: 10mm – 150mm in diameter <500μm in thickness Doped and undoped Germanium

Excellent performance with porous vacuum componets Manufacturers around the world trust our porous materials to deliver excellent performance when used as vacuum components. Anti-static additives can also be introduced for applications that require conductivity. Ensure purity–Material is backed by the Certified Pure POREX™ program of independent laboratory testing of leachables, extractables and interfering substances. Deliver precise flow rates and tolerances–Engineered for tight pore size and volume control. Improve device effectiveness–Design is customizable per application and can incorporate anti-static properties. request sample ask an engineer

Enhance semiconductor processing with pure materials Our high-purity diffusion tubes allow semiconductor processing facilities a precise way to diffuse, filter and distribute process gases. Specifically designed to precise flow and dimensional tolerances, POREX® diffusion tubes: Ensure purity –Material is backed by the Certified Pure POREX™ program of independent laboratory testing of leachables, extractables and interfering substances. Deliver precise flow rates and tolerances–Engineered for tight pore size and volume control. Improve process effectiveness–Design is customizable per application requirements. request sample ask an engineer

For the steel and aluminum industry, Micro-Epsilon offers innovative measuring and inspection systems for thickness, profile and surface measurements. Performance and quality, as well as reliability of products and services have made Micro-Epsilon one of the leading suppliers of inspection systems for optical thickness measurement used in the metals industry. Our non-contact thickness measuring systems are used wherever high-precision thickness monitoring is required for control and quality assurance. Both in hot rolling mills, in continuous casting plants and in cold rolling mills and service centers, the Micro-Epsilon measuring systems operate reliably and with maximum precision. Numerous, successful installations in 13 countries around the world in milling lines and processing lines speak for themselves.

surfaceCONTROL sensors are used for 3D measurements and surface inspections. The sensors use the fringe projection principle to detect diffuse reflecting surface and to generate a 3D point cloud. This point cloud is subsequently evaluated in order to recognize geometry, extremely small defects and discontinuities on the surface. Sensors with different measurement areas are available. This enables the inspection of the finest of structures on components as well as form deviations on large-area attachments. Powerful software packages are available for evaluation and parameter setting.

The Hiresta – UX measuring device is used to measure semiconductors or non – conductors (insulators). Measuring range of 10^3 – 10^14 Ω . The Hiresta UX is specialised in measuring the resistance, the surface and volume resistivity of various substances and materials of all shapes and sizes in the high-resistance measuring range. For measurements related to the ASTM D257 / ISO 2951 / JIS K 6911 standard of: antistatic materials flooring materials paper, packaging materials paints, pastes, paints fibers, clothes, fabrics adhesives, greases glass, concrete, ceramics plastics, film materials, foils etc. Up to 2000 measurement results can be exported to USB memory stick The conductivity meter impresses with its compact design, a color 7.5 “TFT touch display and user-friendly menu navigation.

The Loresta GX is used to measure conductors and semiconductors in the lower resistance range. Measuring range: 10^-4 – 10^7 Ω. It is used to measure the surface resistivity (Ω / □), the volume resistivity (Ω · cm), electrical conductivity (S / cm) in the low-resistance range. The Loresta-GX works according to the 4-pin measuring method. The method is based on the four-wire method and was developed to eliminate the influence of contact resistance. The measuring heads consist of four needle-like electrodes. To simplify the measurement method and calculate the correction factors, all four electrodes are at an equidistant distance from each other. Conductive Materials: Paints, pastes, paints, printing ink, Smart Textiles, Plastics, rubber Film materials, metallic thin films, metallised films, resistor pastes amorphous silicon / silicon wafer, antistatic materials, EMC shielding materials ...

In the manufacture of semiconductors, agitators are mainly used in conditioning of polishing and cutting suspensions, etchants and other auxiliary chemicals, cleaning solutions, or in chemicals recycling. Requirements placed on stirring systems are extremely demanding. Almost always, clean room conditions prevail, meaning that drives and seals must be designed with no abrasion or leakage. Parts that come into contact with the medium, such as the shaft and stirring element, often have to be produced with metalfree surfaces due to the aggressiveness of the media and the purity requirements. Also in this area, Geppert Ruhrtechnik can look back on a very successful history. All well-known chip manufacturers belong to our client base, as well as the manufacturers of the specialty chemicals used in this field. In addition, our agitators are used in broad solar cell production areas.

Machinable Glass Ceramic has a continuous use temperature of 800ºC and a peak temperature of 1000ºC. Its coefficient of thermal expansion readily matches most metals and sealing glasses.It processes good machinability and can be lathed, milled, planed, ground, bored, incised and threaded. It also has the advantages of insulation, pore-free, high/low-temperature resistant, acid and alkali resistant and thermal impact resistant.

The critical process, as well as the parts for semiconductor device, which should be used in high temperature, vacuum and corrosive gas environment, require clean and dustless environment. However, precision ceramic material could maintain high stability in complicated physical and chemical environment. Semiconductor ceramic part we produced with wear resistance, corrosion resistance, low thermal expansion, insulation is made from 99.5% alumina ceramic and shaped by cold isostatic pressing, high temperature sintering and precision machining and polishing, can meet the stringent equirements of parts for semiconductor equipment. Selection of materials Selection of high-quality raw materials, good precision, strict quality control, longer service life Fine structure 20 Years of industry experience, a variety of molding processing technology and production equipment, fine workmanship, tight shape

Speed matters in inspection, process control, or defect and failure analysis for the microelectronics and semiconductor industry. The faster you detect a defect, the faster you can react. With a large field of view, the DM3 XL inspection system allows your team to identify defects faster and increase your yield rate. Make use of the 30% increased field of view of the unique macro objective. Additionally, the DM3 XL uses LED illumination for all contrast methods. LED illumination provides a constant color temperature and offers real color imaging at all intensity levels. - Increase your yield - Reliably detect insufficient development at the edge or within the center of a wafer - Detect uneven radial film thickness - True-to-life color imaging at all intensity levels - Reproducible results

1. The disposable use of ordinary plastic microtips leads to the need for constant replacement, which is time-consuming and costly; 2. PFA plastic pipette tips, low blank value of metal elements (lead and uranium content less than 0.01ppb), suitable for ICP-MS analysis, trace analysis and other experiments; 3. PFA plastic pipette tips can be customized in various sizes, suitable for different types of pipettes; 4. PFA plastic tips do not need to be replaced frequently, and its superior and stable performance enables it to be used for a long time, multiple times, and repeatedly, thereby reducing the number of replacements and effectively saving costs; 5. Professional manufacturers customize PFA plastic tips, fine craftsmanship, no burrs, smooth and easy to clean

The funnel wall has no adhesion and adsorption to the solvent, can be completely emptied, the interface is clearly visible, and the sealing is good, which can prevent the penetration of chemicals in the separatory funnel; the piston device is easy to remove and easy to clean; It is convenient for the user to observe the liquid change in the cavity during the actual sample separation; the control valve made of high-purity experimental grade PTFE can flexibly control the flow; compared with the glass separatory funnel, the advantage is that it can separate hydrofluoric acid, and It is not easy to damage, can be used for a long time, the inner wall is smooth, does not adhere to any substances, and is easy to clean.

Compact design for space saving. Just push plug into socket for connection. Simply push the button on the socket for disconnection. Suitable for a wide range of applications from medical/scientific equipment to beverage machines or semiconductor manufacturing devices. When valveless type socket or plug is used, fluid will flow out of it when disconnected.

Yingxinyuan International (Group) Co., Ltd. was established in 2001. It is one of the largest authorized agents and distributors of electronic components in the world. Its headquarter is located in Shenzhen, China, and it has branches and warehouses in Hong Kong and Taiwan. The company distributes and represents more than 700 brand manufacturers, and there are more than 3 million categories of spot products in warehouses all over the country for a long time, and they can be shipped within 24 hours. The products we promise to sell are guaranteed to be brand new, original and authentic products and provide 365-day warranty service. Please contact our sales team or send the model and quantity you need to yingxinyuan@yxsmd.com.

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

Diodes - Rectifiers - Arrays Products within the diode and rectifier array family incorporate two or more discrete diodes within a single package. They are characterized in terms similar to those used for single discrete diodes, with the addition of a "Diode Configuration" attribute indicating the presence and character of any internal connections between the diodes in the device. Note that arrays with a full-bridge configuration are specifically excluded, and listed as a separate product family.