Printed circuit design - Import export

Printed circuit board design services is one of the ways that we help our customers get to market faster as our engineering team has significant real world experience designing PCBs for performance and manufacturability.

When you are looking for substrates for electronic circuits with a high thermal conductivity and a low expansion coefficient (CTE), ceramic pcb will be your preferred choice of material. Today ceramics are already widely used as substrates in many microelectronic components and power LED packages and more and more they are replacing entire printed circuit boards reducing complexity in design and manufacturing while increasing performance. Examples are Chip-on-board (COB) modules, High power circuits, proximity sensors, battery drivers for EVs, … .

We carry out a full cycle of development of electronic devices: supply of electronic components, stencils and printed circuit boards, design of electronics, redesign of finished devices. Applying the principles of lean production, we achieve a price reduction while maintaining a high quality of services. Due to quality control at all stages of production, we have the reject rate less than 0.5% (at observance of all requirements to the order). Operative daily planning allows us to achieve maximum efficiency in the use of working time. Thanks to that, in the presence of all the equipment in the warehouse, we can take the order to work during the day from the moment of order. We have our own high-tech equipment, and offering good quality with competitive assembly cost.

Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid

Origin: China Model Number: JXFPC Min. Hole Size: 0.20mm Materials: PI/PET Type: FPC Layers: 1-6 Finished surface: OSP/ENIG Board thickness: 0.2mm Solder mask color: orange Certificate: ISO9001 Copper weight: 1 OZ Base Material: PI/PET Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.20mm Min. Line Width: 0.1mm/4mil Min. Line Spacing: 0.1mm/4mil Surface Finishing: OSP/ENIG Supply Ability: 3000 Square Meter/Square Meters per Month Packaging Details: packing with anti-static red/white bubble Port: Xiamen

Ceramic prined circuit board feature many advantages over metal core and FR4 circuit boards as they combine excellent thermal characteristics with low a expansion. They are also suitable for multilayer applications, show lower deformation, warpage and operate under higher temperatures. Elite advanced technologies is your partner for ceramic substrates and circuit boards. Thanks to our large laser facilities and patented printing technology we are able to accomodate both very tight tolerances as well as high volume production at a high quality.