Integrated circuits (ics) - Import export

The Aluminum oxide (Al2o396%) ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. The Maximum dimension of ceramic plate is 138x138mm and the thickness of ceramic plate ranges from 0.25 to 1.0mm. Features: 1.High reliablility and sfety; 2.High density and mechanical properties 3.High electrical and thermal loading perormances 4.Low dilelectic loss and other characteristics

The Aluminum oxide (Al2o3) 96% ceramic plates are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. Alumina ceramic substrate / plate specification: > 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. > The thickness of ceramic plate ranges from 0.25 to 1.0mm Can be made according to your requirements.

The Aluminum oxide (Al2o3) 96% ceramic plates are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. Alumina ceramic substrate / plate specification: > 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. > The thickness of ceramic plate ranges from 0.25 to 1.0mm Can be made according to your requirements.

The Aluminum oxide (Al2o3) 96% ceramic plates are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. Alumina ceramic substrate / plate specification: > 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. > The thickness of ceramic plate ranges from 0.25 to 1.0mm Can be made according to your requirements.

The Aluminum oxide (Al2o3) 96% ceramic plates are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. Alumina ceramic substrate / plate specification: > 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. > The thickness of ceramic plate ranges from 0.25 to 1.0mm Can be made according to your requirements.

The Aluminum oxide (Al2o3 96%) ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. The Maximum dimension of ceramic plate is 138x138mm and the thickness of ceramic plate ranges from 0.25 to 1.0mm. Alumina Ceramic Substrate Features: > High reliablility and sfety; > High density and mechanical properties > High electrical and thermal loading perormances > Low dilelectic loss and other characteristics Alumina ceramic substrate / plate specification: 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. Can be made according to your requirements.

We specialize in engineering high quality composites for management of heat in electronics packages, particularly Integrated Circuit (IC) packaging. These composite materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC). Turnkey Solution for Production Ready Pedestals Our advanced thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging. Sizes Our heat spreader materials for IC packages are offered in a wide breadth of sizes including: Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm) Down to finished machined and plated products in 0.015” (0.381mm) cubes Hermetic Housings and Heat Sinks These thermal management products are used as both the hermetic housings and as the expansion-matched

Yingxinyuan International (Group) Co., Ltd. was established in 2001. It is one of the largest authorized agents and distributors of electronic components in the world. Its headquarter is located in Shenzhen, China, and it has branches and warehouses in Hong Kong and Taiwan. The company distributes and represents more than 700 brand manufacturers, and there are more than 3 million categories of spot products in warehouses all over the country for a long time, and they can be shipped within 24 hours. The products we promise to sell are guaranteed to be brand new, original and authentic products and provide 365-day warranty service. Please contact our sales team or send the model and quantity you need to yingxinyuan@yxsmd.com.

Yingxinyuan International (Group) Co., Ltd. was established in 2001. It is one of the largest authorized agents and distributors of electronic components in the world. Its headquarter is located in Shenzhen, China, and it has branches and warehouses in Hong Kong and Taiwan. The company distributes and represents more than 700 brand manufacturers, and there are more than 3 million categories of spot products in warehouses all over the country for a long time, and they can be shipped within 24 hours. The products we promise to sell are guaranteed to be brand new, original and authentic products and provide 365-day warranty service. Please contact our sales team or send the model and quantity you need to yingxinyuan@yxsmd.com. We will reply to your message as soon as possible.

Yingxinyuan International (Group) Co., Ltd. was established in 2001. It is one of the largest authorized agents and distributors of electronic components in the world. Its headquarter is located in Shenzhen, China, and it has branches and warehouses in Hong Kong and Taiwan. The company distributes and represents more than 700 brand manufacturers, and there are more than 3 million categories of spot products in warehouses all over the country for a long time, and they can be shipped within 24-72 hours. The products we promise to sell are guaranteed to be brand new, original and authentic products and provide 365-day warranty service. Please contact our sales team or send the model and quantity you need to yingxinyuan@yxsmd.com. We will reply to your message as soon as possible.

Yingxinyuan International (Group) Co., Ltd. was established in 2001. It is one of the largest authorized agents and distributors of electronic components in the world. Its headquarter is located in Shenzhen, China, and it has branches and warehouses in Hong Kong and Taiwan. The company distributes and represents more than 700 brand manufacturers, and there are more than 3 million categories of spot products in warehouses all over the country for a long time, and they can be shipped within 24 hours. The products we promise to sell are guaranteed to be brand new, original and authentic products and provide 365-day warranty service. Please contact our sales team or send the model and quantity you need to yingxinyuan@yxsmd.com.

Aluminum composite foil bags, also known as aluminum vacuum bags, are produced in our production from highquality raw materials on fully automatic production lines and are characterized by the following properties Antistatic Waterproof Electrostatic shield Heat sealable The size of the bags is not fixed by default but rather can be implemented individually for our customers also as a 3in1 solution including tailormade desiccant and moisture indicator. Style and size are variable, such as flat bags, 3D bags, etc. The production takes place in strict accordance with the standards GB / T 10371988, GB / T 10382000, MILB81705C. Packaging of electronic components Packaging of printed circuit boards (PCB Packaging of integrated circuits (IC) Packaging of hard drives

Origin: China Model Number: JXFPC Min. Hole Size: 0.20mm Materials: PI/PET Type: FPC Layers: 1-6 Finished surface: OSP/ENIG Board thickness: 0.2mm Solder mask color: orange Certificate: ISO9001 Copper weight: 1 OZ Base Material: PI/PET Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.20mm Min. Line Width: 0.1mm/4mil Min. Line Spacing: 0.1mm/4mil Surface Finishing: OSP/ENIG Supply Ability: 3000 Square Meter/Square Meters per Month Packaging Details: packing with anti-static red/white bubble Port: Xiamen