Embedded modules - Import export

The WCE2000 sets the standard for high-speed wire embedding and RFID inlay production: Superior quality, highest accuracy and unmatched productivity at an unbeatable price-performance ratio. The system can be designed to perfectly match your needs: sheet to sheet (S2S), reel to sheet (R2S), or reel to reel (R2R). This flexible solution offers the most economical way to produce RFID inlays for ID documents in large quantities. You get unrivalled real-world throughput: up to 4,050 antennas/hour as antenna embedding machine and up to 2,000 finished RFID inlays/hour as inlay manufacturing line. The WCE2000 is available in virtually unlimited configurations. Wire coil embedding, module pick & place, soldering, and testing are the main features that can be integrated to build a tailor-made solution. Punching, sheet cutting, handling and collation of additional layers, and other features complement the system to a complete inlay manufacturing line. The possibility to combine all of...

The WCE700 is a semi-automatic system designed to produce RFID inlays for ID documents (ID-1 and ID-3 format). Based on a 4-station roundtable concept with manual load and unload, this very economical solution can handle both small jobs and high-volume runs with ease. Depending on the configuration, it can produce up to 1,600 inlay sheets/hour. The machine can also be used solely for antenna embedding, with unrivalled speed, accuracy and the quality of antennas that it produces. This modular system is equipped with ultrasonic wire embedding, automatic chip module punching and module placement at defined positions on the table. The electrical connection between antenna and module is accomplished either by thermo-compression bonding or soldering method. The operator will feed and take out the inlay sheet manually. The WCE700 is capable to work with a wide range of materials, and variables like the size and shape of the antenna can easily be adapted to the specific requirements. Our...

Fieldbus products are applicable to the design and development of all kinds of fieldbus devices. We provide fieldbus communication chips-M series embedded communication modules-G series fieldbus protocol conversion gateways and other products for different needs to help users quickly complete the development of fieldbus intelligent instruments. https://www.microcyber-fieldbus.com/product/fieldbus-hart-to-modbus-gateway

Using our TM1 it is the ideal module for an Internet of Things (IoT) device. The TM1+6 can be used where Wi-Fi, Bluetooth and/or Ethernet is required. Together with three asynchronous RS232/422/485 ports, the TM1+6 is an extremely versatile host board which can support a wide range of applications. The TM1+6 is also used in our Beta range of embedded touch display modules by combining it with our LCD, touchscreen, mechanicals, cables and Android or Linux operating systems.

Digi-Pas® DWL5000XY Series is a 2-Axis Inclination Sensor Module that specifically designed to be integrated into a machine/equipment/ structure for real-time simultaneous monitoring of leveling position, tilt angles & vibration measurement. These intelligent modules are embedded with advanced MEMS technology sensor, developed for 2D planar leveling, tilt angle monitoring, alignment and vibration measurement. The 'plug & play' software interface instantly enables application engineers to access sensor modules without the need for tedious and time-consuming programming. Sensor modules are tough, durable, waterproof, shock resistance, small footprint and enabled to communicate through various protocols such as USB, RS232, RS485 & Bluetooth. Digi-Pas® DWL-5000XY is a 2-Axis Precision Inclination Sensor Module of accuracy (0.01° or 175µm/M or 36 arcsec) Digi-Pas® DWL-5500XY is a 2-Axis Precision Inclination Sensor Module of accuracy (0.001° or 18µm/M or 3.6 arcsec)