Embedded modules - Import export

ARM11 module with i.MX35 from Freescale Key functionalities All CPU interfaces are available Extended boot options (USB, SD card) eMMC-Flash Extended temperature range Low power consumption (typ. 2-3 W) Long-term availability IEC 61850 stack

ARM Cortex-A8 module with Sitara™ AM335x from Texas Instruments. Key functionalities Real-time communications subsystem Low-cost due to highest level of integration Extended temperature range 2x IEEE1588 Ethernet (L2 Switch) Low power consumption (typ. 2 W) Long-term availability

ARM Cortex-A8 module with Sitara™ AM335x from Texas Instruments. Key functionalities Real-time communications Subsystem Recommended for high quantity use Low-cost due to highest level of integration Extended temperature range 2x IEEE1588 Ethernet (L2 Switch) Low power consumption (typ. 2 W) Long-term availability

ARM Cortex™-A9 module with i.MX6 from Freescale. Key functionalities Graphic Extended temperature range e-MMC Flash NOR Flash Low power consumption (typ. 4 W) Long-term availability IEEE 1588 Support Security functions

ARM9 module with i.MX28 from Freescale Key functionalities Low-cost due to highest levels of integration Compact dimensions Extended temperature range 2x IEEE1588 Ethernet (L2 Switch) Low power consumption (typ. 1 W) Long-term availability Power management IEC 61850 stack

ARM Cortex™-A8 module with i.MX53 from Freescale Key functionalities All CPU interfaces are available Graphics Extended temperature range e-MMC-Flash Low power consumption (typ. 3 W) Long-term availability IEEE 1588 support Security functions

ARM Dual Cortex™-A7 module with LS102xA from Freescale. Key functionalities Graphics Extended temperature range High-Speed communication via 3x Gigabit Ethernet, 2x PCle and 1x USB 3.0 interface Low power consumption (typ. 3 W) QorIQ Trust Architecture and ARM TrustZone IEEE 1588 support Security functions and QUICC Engine

ARM9 module with i.MX28 from Freescale Key functionalities Smallest ARM9 module High quantity use 2x IEEE1588 Ethernet (L2 Switch) Extended temperature range Low power consumption (typ. 1 W) Long-term availability Power management Battery charge functionality IEC 61850 stack

Power Architecture module with MPC5200 from Freescale Key functionalities Freescale MPC5200 (Power Architecture), 400 MHz High graphics performance through integrated graphics controller (SM501/SM502) Substantial computing power, numerous interfaces Multifunctional external busses (PCI / ATA / IDE) Compact outer dimensions (80mm x 60mm) Low power dissipation, passive cooling Robust 0,8mm mezzanine connection system, long-term availability

Power Architecture module with MPC5200 from Freescale. Key functionalities Freescale MPC5200 (Power Architecture), 400 MHz Substantial computing power, numerous interfaces Multifunctional external bus (PCI / ATA / IDE) Up to 6 serial interfaces Compact outer dimensions (60mm x 56mm) Low power dissipation, passive cooling Robust 0,8mm mezzanine connection system, long-term availability Temperature sensor

Power Architecture module with QorIQ™ T1042 processor from Freescale. Key functionalities Quad core up to 1400 MHz in 28 nm SOI for the best Performance/Watt ratio High-speed communication via 5x Gigabit Ethernet, 4x PCle and two USB 2.0 High Speed interfaces Dual SATA interfaces for data storage Easy function extensions via PCle, eSPI, I²C and IFC (Local Bus) IEEE 1588 time synchronization in hardware Extremely compact module dimensions Display Interface Unit

Power Architecture module with Freescale QorIQ™ P2020 processor Key functionalities Easiest migration of PowerQUICC III on QorIQ™ by approved e500v2 core Single (P2010)- and MultiCores (P2020) of 400 up to 2x 1200 MHz in 45nm SOI for best Performance/Watt ratio High-Speed communication via 3x Gigabit Ethernet, 3x PCIe and one USB 2.0 interface Simple function extension via PCIe, SPI, I²C and flexible local bus

Power Architecture module with Freescale QorIQ™ P1020 processor. Key functionalities Easiest migration of PowerQUICC III on QorIQ™ by approved e500v2 core Single (P1011/P1012)- and MultiCores (P1020/P1021) of 400 up to 2x 800 MHz in 45nm SOI for best Performance/Watt ratio High-Speed communication via 3x Gigabit Ethernet, 2x PCIe and one USB 2.0 interface Simple function extension via PCIe, SPI, I²C and flexible local bus

COM Express™ Compact Module (Type 6) Key functionalities Intel® Core™ 5000U series („Broadwell-U") with up to 3.2 GHz / 4 MB Cache Up to 16 GB DDR3L on board memory Best Performance-per-Watt ratio (15W TDP) Reach featured uEFI BIOS with easy-config, multi- setup and touch support TQMx86 board controller with flexible customization options (flexiCFG) TPM 1.2 / 2.0 iRTC (highly accurate industrial real time clock) "Green ECO-Off" (minimum of standby power) Watchdog und thermal Management Highest reliability, 24/7 certified Rugged design / Conformal coating capability Quality Made-in-Germany

ColdFire module with MCF5329 from Freescale. Key functionalities Low-cost due to highest levels of integration Extended temperature range Large number of interfaces Low power consumption (typ. < 1 W) Long-term availability Small dimensions

Power QUICC II Pro module with MPC8315 from Freescale. Key functionalities Freescale e300 Core with 400 MHz for highest computing efficiency High-speed communication via 2x Gigabit Ethernet, 2x SATA and USB 2.0 Functions can be easily extended via PCIe, PCI, SPI, I²C and flexible local bus Encrypted data communication IEEE1588 time synchronisation Extremly compact dimensions (70mm x 50mm) Low power consumption (< 3 W) enables passive cooling Extended temperature range *NRND=Not Recommended for New Designs

COM Express™ Mini Module (Type 10) Key functionalities Intel® Atom TM E3800 ("Bay Trail-I") Up to 8 GB DDR3L with ECC support, soldered Optimized for ultra low power Extended temperature support Reach featured uEFI BIOS with easy-config, multi-setup and touch-support TQMx86 board-controller with customer specific expandability (flexiCFG) USB 3.0 device interface TPM 1.2 / 2.0 iRTC (highly accurate Industrial Real-Time-Clock) "Green ECO-Off" (minimum of standby power) Watchdog and thermal management Highest reliability, 24/7 certified Extra robust Design Formal coating capability COM Express™ Mini Type 10 (COM.0, R 2.1)

The WCE700 is a semi-automatic system designed to produce RFID inlays for ID documents (ID-1 and ID-3 format). Based on a 4-station roundtable concept with manual load and unload, this very economical solution can handle both small jobs and high-volume runs with ease. Depending on the configuration, it can produce up to 1,600 inlay sheets/hour. The machine can also be used solely for antenna embedding, with unrivalled speed, accuracy and the quality of antennas that it produces. This modular system is equipped with ultrasonic wire embedding, automatic chip module punching and module placement at defined positions on the table. The electrical connection between antenna and module is accomplished either by thermo-compression bonding or soldering method. The operator will feed and take out the inlay sheet manually. The WCE700 is capable to work with a wide range of materials, and variables like the size and shape of the antenna can easily be adapted to the specific requirements. Our...

Fieldbus products are applicable to the design and development of all kinds of fieldbus devices. We provide fieldbus communication chips-M series embedded communication modules-G series fieldbus protocol conversion gateways and other products for different needs to help users quickly complete the development of fieldbus intelligent instruments. https://www.microcyber-fieldbus.com/product/fieldbus-hart-to-modbus-gateway

Industrial control with Freescale MPC5200. Key functionalities Embedded module TQM5200S High computing power Low power dissipation (< 2 W) enables passive cooling Extended temperature range Small dimensions (120mm x 105mm x 30mm) Long-term availability (> 10 years) Robust aluminum housing, electronics optimized for vibrations Linux (Kernel 2.6), CoDeSys on request

The STMicroelectronics M4T28-BR12SH1 is a battery-backed real-time clock (RTC) and crystal oscillator module. It is designed to provide a reliable timekeeping solution for embedded systems. The module combines a lithium battery, a 32.768 kHz crystal oscillator, and a low-power CMOS RTC circuit in a single package.

Using our TM1 it is the ideal module for an Internet of Things (IoT) device. The TM1+6 can be used where Wi-Fi, Bluetooth and/or Ethernet is required. Together with three asynchronous RS232/422/485 ports, the TM1+6 is an extremely versatile host board which can support a wide range of applications. The TM1+6 is also used in our Beta range of embedded touch display modules by combining it with our LCD, touchscreen, mechanicals, cables and Android or Linux operating systems.

Digi-Pas® DWL5000XY Series is a 2-Axis Inclination Sensor Module that specifically designed to be integrated into a machine/equipment/ structure for real-time simultaneous monitoring of leveling position, tilt angles & vibration measurement. These intelligent modules are embedded with advanced MEMS technology sensor, developed for 2D planar leveling, tilt angle monitoring, alignment and vibration measurement. The 'plug & play' software interface instantly enables application engineers to access sensor modules without the need for tedious and time-consuming programming. Sensor modules are tough, durable, waterproof, shock resistance, small footprint and enabled to communicate through various protocols such as USB, RS232, RS485 & Bluetooth. Digi-Pas® DWL-5000XY is a 2-Axis Precision Inclination Sensor Module of accuracy (0.01° or 175µm/M or 36 arcsec) Digi-Pas® DWL-5500XY is a 2-Axis Precision Inclination Sensor Module of accuracy (0.001° or 18µm/M or 3.6 arcsec)