Ceramic pastes - Import export

Lubrication of all kinds of highly stressed sliding surfaces, especially at low slip speeds or with oscillating movements Surface separation of temperature-stressed threaded connections For stainless-steel connections Advantages and benefits Broad field of application Good wear and corrosion protection Prevents burning-on and cold welding Good pressure absorption capacity No classification marks according to (EG) No. 1272/2008 Prolonged lubrication effect Metal-free For best adhesion, clean contamination and other lubricants from thread and slide surfaces. Best way is to clean mechanically first (for example, with a wire brush) and then with OKS 2610/OKS 2611 universal cleaning agent. Use a brush, spatula or similar to apply evenly a suitable quantity of paste to the head or nut contact surface and to the thread. The paste also acts as a sealant against spray water and condensate. Do not use paste instead of grease and mix only with suitable lubricants.

AMB Ceramic Substrate is a method to realize the bonding of ceramic and metal by reacting a small amount of active elements Ti and Zr in filler metal with ceramics to form a reaction layer which can be wetted by liquid filler metal. Advantage: The combination is achieved by chemical reaction between ceramic and active metal solder paste at high temperature, so its bonding strength is higher and reliability is better. Disadvantage: The reliability of AMB process depends largely on the composition of active filler metal, brazing process, brazing layer structure and many other key factors。 Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)