Aluminum Nitride / Silicon Nitride AMB Ceramic Substrate

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Description

AMB Ceramic Substrate is a method to realize the bonding of ceramic and metal by reacting a small amount of active elements Ti and Zr in filler metal with ceramics to form a reaction layer which can be wetted by liquid filler metal. Advantage: The combination is achieved by chemical reaction between ceramic and active metal solder paste at high temperature, so its bonding strength is higher and reliability is better. Disadvantage: The reliability of AMB process depends largely on the composition of active filler metal, brazing process, brazing layer structure and many other key factors。 Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)

  • Ceramics, industrial
  • AlN AMB Ceramic Substrate
  • Silicon Nitride AMB Substrate
  • Active Metal Brazing AMB Ceramic Substrate

Product characteristics

Metallization thickness:
25 ±10um
Nickel thickness:
2~10um
Plating Thickness:
2-9μm
Density:
3.7g/cm3
Thermal Conductivity:
25W/(m.k)
Max. Use Temperature:
1600℃

Domain icon Manufacturer/ Producer

361006 Xiamen - China

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