Vacuum processes - Import export

Keiper haul-off timing belts are made with polyurethane or neoprene timing belts that are finished with many different kinds of coatings. They are used for conveying foils in bag forming, filling and sealing machines as well as numerous other conveying tasks. The extensive range of designs offers the optimal solution for any transport task and application, e.g. with smooth or vacuum-processed surface, finished according to individual specifications, and with many different coatings. Timing belts - Polyurethane molded timing belts - or neoprene molded timing belts Tension cords - Steel - Aramid - Polyester Coatings - PU yellow - Linatex - Various elastomers - Silicone

The vacuum forming process, implemented with simple tools, is ideal for three-dimensional shaping. In modern thermoforming machines with a table size of 1000 x 660 mm up to 2000 x 1200 mm, both negative and positive moulds can be used. Furthermore, we can process the components with our 5-axle-milling-machines afterwards.

Not only uneven, structured surfaces but also undefi ned pick-up positions and varying dimensions can be easily be handled with the aid of the VUSS vacuum gripper. Be it in logistics, small trade or industry. AERO-LIFT® VUSS facilitates the use of vacuum lifting equipment now for your materials – regardless of whether a pallet of cans is not full or there is a pile of wooden boards laying loosely together or every workpiece has an individu-al, different size. process automation with vacuum gripper more efficiency and flexibility Function and features structure vacuum gripper The basic principle is really simple: The robot attaches a vacuum plate to the product to be transported instead of grabbing it. In such cases, it does not matter whether the products have holes, are slanted...

BSV Series DN 100 – 400 The Ball Segment Valve, BSV for short, is the result of a development of an innovative valve for pharmaceutical and fine chemical processes. For a wide range of solids applications, it is the preferred valve for process equipment like vacuum dryers, reactors or centrifuges as both as inlet and discharge valve. Even if products are not free flowing, have an abrasive effect or have moist and adhesive properties, the Ball Segment Valve is the right choice as a reliable, vacuum and pressure-tight process valve. The internal corner-free and edge-free housing does fullfill your cGMP requirements and leaves the ball segment sufficient space to move clear of the product flow path when opened. A reactor agitator or mixing tool can be designed to move within a few millimetres of the Ball Segment Valve virtually eliminating dead-space in the process area. Besides the standard flanges, the BSV can be equipped with tailored and non DIN flange connections to suit most...

COMBER Condry® - Series TDC 25 - TDC 15000 The Condry conical bottom agitated vacuum dryer was developed to process a wide variety of products. The machines have proven to be particularly suited for the drying of heat sensitive products as well as products with fragile crystal structure and thus sensitive to shear forces. The conical bottom allows for full product discharge characteristics. Special properties for the customer’s benefit: In compliance with cGMP and FDA guidelines, also in aseptic/ steam sterilizable versions Excellent product discharge performance with negligible product hold-up due to the conical vessel bottom, very close agitator to wall/bottom clearances and a unique agitator design The agitator permits uniform mixing of the entire product mass, without the formation of lumps or balls The surface area for heat transfer is maximized for optimum performance and cycle times Agitator supported by the top head, with the seal in contact with the vapors only Entirely...

COMBER Pressofiltro® / Turbodry® Series PF/TD 5 - PF/TD 100 This Pilot Plant can either be used as Agitated Nutsche Filter/Filter Dryer or a Vacuum Dryer. Designed for processes in pilot plants, it is fully equipped for tests and trials and can as well be used for small scale production. Special properties for the customer’s benefit: Calculation, manufacture and design are in accord with Pressure Equipment Directive 97/23/EG or/and ASME U-stamp as well as with cGMP and FDA guidelines Approved for using in ATEX danger zone, group II 2G 2D (zones 1/ 21) Suitable as vacuum dryer, filter dryer or agitated nutsche filter Shaft seal through gland nut Device built on skid Control system protected against explosion (EEx-d) Options Multilayer PLC-system

The Vacuum Chamber VC P305X300 is made of a unique, flexible chamber system based on extruded aluminium profiles. The three meter long profiles are cut to the desired length and equipped with a bolted rear wall and a door. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: up to 3000 mm (standard: 370 mm, 620 mm) Width: 305 mm Height: 300 mm Front panel (optional): 9 U (1 U = 44.45 mm) Connections 1 x KF 16 5 x KF 40 Additional flanges possible in any position

Specially developed for use under high vacuum, our vacuum chamber VC P400x400 HV is made of a unique, flexible chamber system based on extruded aluminium profiles. The three-metre long profiles are cut to the required length and fitted with a screwed rear wall, as well as a door. Unlike our standard VC P400x400, the VC P 400x400 HV has no slots in the side walls. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: up to 3000 mm (standard: 625 mm) Width: 400 mm Height: 400 mm Connections 1 x KF 16 6 x KF 40 Additional flanges possible in any position

The VC M600² is based on our new modular chamber system. The system consists of individual, fully milled aluminum modules with a depth of 500mm. Thus the length of the chamber can be variably set in 500mm steps. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: 1000 mm (modular in 500 mm steps) Width: 600 mm Height: 600 mm Connections 2 x KF 16 6 x KF 40 1 x ISO K 63 1 x ISO K 160 Additional flanges possible in any position

Vacuum degassing / outgassing With the aid of vacuum outgassing, unpleasant tastes or odors can be degassed and thus rendered tasteless. Altitude simulation For aircraft transport, it is essential to perform tests and simulations at a pressure <800 mbar, since in cargo holds, pressure equalization takes place, but cannot compensate for all fluctuations. Vacuum storage systems The safest way to store highly sensitive components is under vacuum. Under the vacuum environment, your components are protected from all external influences. Control and process control Our specially developed control program offers not only the possibility to monitor, but also to program and store various process sequences. High and ultra-high vacuum From the pressure range of rough vacuum to fine vacuum and ultra-high vacuum, we are able to meet your process requirements with our systems.

The VC M1200² is based on our new modular chamber system. The system consists of individual, fully milled aluminum modules with a depth of 500mm. Thus the length of the chamber can be variably set in 500mm steps. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: 1000 mm (modular in 500 mm steps) Width: 1200 mm Height: 1200 mm Connections 2 x KF 16 6 x KF 40 1 x ISO K 63 1 x ISO K 160 Additional flanges possible in any position

The VC M1000² is based on our new modular chamber system. The system consists of individual, fully milled aluminum modules with a depth of 500mm. Thus the length of the chamber can be variably set in 500mm steps. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: 1000 mm (modular in 500 mm steps) Width: 1000 mm Height: 1000 mm Connections 2 x KF 16 6 x KF 40 1 x ISO K 63 1 x ISO K 160 Additional flanges possible in any position

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tetra 45 low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 45 litres of this plasma system offers enough space to serve series production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tretra 320R low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 320 litres of this plasma system offers enough space to serve series production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Atto low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 10.5 litres of this plasma system offers enough space to serve laboratory and also small series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ...

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tetra 30 low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of 34 up to 50 litres of this plasma system offers enough space to serve series production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Nano low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of 18 up to 24 litres of this plasma system offers enough space to serve laboratory and also series production. Plasma treatment in low-pressure plasma is a proven technique for controlled ultra-fine cleaning, improvement of adhesion (activation and etching) and coating of thin layers on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues. Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Zepto low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 1 - 4 litres of this plasma system offers enough space to serve laboratory and small series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ...

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tetra 1440 low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 1440 litres of this plasma system offers enough space to serve series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Femto low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of 2 to 3 litres of this plasma system offers enough space to serve laboratory and small series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tetra 2800 low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 2800 litres of this plasma system offers enough space to serve series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tetra 150 low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 150 litres of this plasma system offers enough space to serve series production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tetra 100 low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 100 litres of this plasma system offers enough space to serve series production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings