Cards - Import export

Contacting WLCSP, SiP or flipchip wafers requires probe cards that can tolerate high currents while ensuring high signal integrity. The FeinProbe® addresses these applications perfectly.

Probe card with lamella contact elements, especially suitable for RF applications with a high design variety.

MµProbe® probe cards are characterized by MEMS contact elements and are particularly suitable for fine pitch full array applications in wafer test.

New version of vertical contact technology with focus on increased service life and other advantages.

Adaptable to an enormous range of applications, the ViProbe® is a proven buckling beam technology for more than 25 years, valued above all for its uniquely easy reparability.

The fiber material, serving as filling, is processed in-house into fleeces.  The true skill is to produce a solid fleece with optimal fluffiness and the right degree of warmth delivery (heat coefficient).