Bonding - Import export

Our ovens and line concepts for bonding and finishing of nonwovens stand for maximum production output, low energy consumption and highest precision regarding temperature distribution, air circulation and coating application. We can offer different application systems such like foam impregnation units, padders, spray cabinets, powder scattering units, coating heads and many others. In addition, we can offer complete lines like airthrough doublebelt thermofusion ovens, airthrough dryers for lightweight nonwovens, airthrough dryers for high speed spunlace lines for wipes or wetlaid nonwovens. Our customers are active in the fields of hygienics & medicine, construction & geotextiles, clothing & comfort, cleaning & care, automotive & transport, filtration and many more.

Product group: Cellular Assays/ Detection-Labeling- kits Storing temperature: 2-8°C Shipping condition: ambient

Product group: Cellular Assays/ Detection-Labeling- kits Storing temperature: -20°C

Product group: Cellular Assays/ Detection-Labeling- kits Storing temperature: 2-8°C Shipping condition: ambient

Self-adhesive pre-cutted foam liners that are placed inside the screw cap. The adhesive is activated by screwing tha cap on the jar with enough pressure. This way the insert provides a very high adhesion on glass and plastic containers. No sealing machine needed. Delivered with standard print: SEALED for YOUR PROTECTION Primarily suitable for dry products.

Self-adhesive pre-cutted foam liners that are placed inside the screw cap. The adhesive is activated by screwing tha cap on the jar with enough pressure. This way the insert provides a very high adhesion on glass and plastic containers. No sealing machine needed. Delivered with standard print: SEALED for YOUR PROTECTION Primarily suitable for dry products.

RAFI Eltec has over 20 years of experience in the special technology chip-on-board. That gives us a profound understanding of processes and quality in the standard technologies and beyond. As a result, we meet your requirements for flexible and reliable implementation of technically sophisticated solutions. We even set new standards. CHIP-ON-BOARD TECHNOLOGIES • Chip-on-board bonding • Chip-on-chip bonding • Chip-on-flex bonding • Flip chip TECHNOLOGIES IN THE CLEAN ROOM • Die bonding • Wire bonding (aluminum wire bonding and gold wire wedge-wedge bonding) • Glob top casting • Optical casting • Application of HF seals

Draw-in thread for chairs, upholsteries, slippers / Extreme rub and abrasion resistance / High reliability on automatic sewing machines thanks to inner bonding / Excellent sewability / Ideal for 2-needle machines / Optimum durability