Silicon carbide - Import export

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

The extreme hardness and angular yet sharp-edged properties is typical of black silicon carbide type WIWOX® SI. It is particularly suitable to machine hardened steel and ceramics. It consists of crystalline silicon carbide, which is produced from silica sand and petroleum coke in electric resistance furnaces at temperatures of > 2.300° C. Silicon carbide is iron-free, angular and extremely hard.

single inlet line aluminium housing silicon carbide seal dry running (7600T) PRESSURE MAXIMUM 100,0 bar coolant TEMPERATURE MAXIMUM 90 °C coolant SPEED MAXIMUM 24000 1/min SIZEDN 8 (1/4") DN 10 (3/8")

WIWOX® MT micro blasters are used for precise blasting with blasting nozzles from 0.4 – 1.8 mm. Surfaces can be smoothed, matted, deburred or cleaned. All mineral media, e.g. glass beads, broken glass, corundum, silicon carbide in the grain size range from 0 to 300 mμ serve as blasting media. The abrasive is used only once. The blasted surface is reproducible. Only a compressed air connection is required to operate the equipment. Micro-Tip fine blast units are suitable as portable free blast units or in combination with a blast cabinet. Micro-Tip fine blasting technology is available as a pressure or injector process. All units are equipped with foot pedal, pressure regulator, manometer and carbide nozzles.

Screw spindle pumps with their silicon carbide spindle housing and highly wear resistant spindles are capable of achieving extremely high pressures. Brinkmann high pressure screw pumps are designed for pumping filtered and lubricating fluids such as coolant oils andwatersoluble coolants. High pressure screw pumps are NOT designed for dry-running. Screw spindle pumps are positive displacement pumps which always require the installation of a pressure relief valve in order to prevent bursting. Volumetric delivery: up to 878 l/min Delivery pressure: up to 200 bar Please contact us for delivery quantity

Screw spindle pumps with their silicon carbide spindle housing and highly wear resistant spindles are capable of achieving extremely high pressures. Brinkmann high pressure screw pumps are designed for pumping filtered and lubricating fluids such as coolant oils andwatersoluble coolants. High pressure screw pumps are NOT designed for dry-running. Screw spindle pumps are positive displacement pumps which always require the installation of a pressure relief valve in order to prevent bursting. Volumetric delivery: up to 878 l/min Delivery pressure: up to 200 bar Please contact us for delivery quantity

The microPRO™ XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3DMicromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. The microPRO™ XS for OCF features a UV wavelength diode pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat related damage to the frontside of the wafer. Best in class cost per wafer High throughput – 150mm wafers can be processed in a single step Flexible recipe programming and wide parameter range.

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.