Electronic assemblies - Import export

Testing services from a specialist: we are specialized as a testing laboratory for the simulation of specific environmental conditions and the monitoring of the influences of these conditions on electronic assemblies. We offer the following services in our test lab and at your site as contract testing.

Mechatronic integrated devices or molded interconnect devices (injection-molded circuit carriers) are spatial electronic assemblies – so-called 3D-MID. A special process is used to apply metallic conductor tracks to a specific substrate material (often plastic), thus creating three-dimensional assemblies that also serve as circuit carriers. These spatial electronic assemblies are manufactured using 3D-MID technology and, compared to conventional assemblies, enable the integration of electronic, mechanical, fluidic, optical and thermal functions. The resulting additional benefits represent advantages that cannot be realized with two-dimensional circuit carriers (printed circuit boards).

In an environmental simulation, assemblies are subjected to defined environmental conditions to validate their behavior under those conditions. The variables of an environmental simulation test include climatic aspects such as temperature (cold, heat), the air conditions (humidity, wetness), mechanical influences such as dust, vibration, vibration or impacts, and corrosive environmental effects such as salty lift (salt fog). As an environmental simulation laboratory, we simulate these environmental conditions in our climatic chambers and climatic chambers, creating real conditions to investigate the long-term behavior of the test specimens in reality. Environmental simulation and thermal shock testing laboratory for electronic assemblies and printed circuit boards We specialize in performing environmental simulation and temperature shock testing of electronic and mechanical assemblies. With over ten years of experience with the requirements of the automotive industry and medical

We are specialized in performing thermal shock testing of electronic and mechanical assemblies and have a lot of experience with the requirements of the automotive industry and medical technology. On behalf of our customers, we perform environmental and climatic tests according to customer specifications and applicable standards, thus uncovering optimization potential. We will be happy to advise you with regard to your testing tasks and, together with you, transfer the entire testing process into a specification sheet. OUR OPPORTUNITIES 2-chamber system air-air Test chamber volume up to 130 liters Temperature range hot chamber 50°C to 200°C Temperature range cold chamber -80°C to -100°C Change between chambers <15 seconds Maximum test material weight 25 kg State monitoring of the test specimens during the test

With the help of the 3D-MID process, plastic parts can be metallized not only over the entire surface, but also selectively. To do this, the plastic part is activated with a special laser at the points that are to be coated (this is referred to as laser activation or laser direct structuring). The additives contained in the plastic directly under the plastic surface are “exposed” by the laser treatment. In a chemical bath, copper particles can then be deposited specifically only on the activated surfaces. Other metals, e.g. nickel, tin or gold, can then be deposited onto the starting layer of copper. In this way, a selectively coated plastic part is obtained. MID technology thereby makes it possible to selectively coat two-dimensional and also three-dimensional plastic parts and use them, for example, as circuit carriers for electronic or mechatronic assemblies. With the LPKF-LDS process

We offer laser direct structuring (LPKF-LDS process) for the production of 3D-MID (so-called three-dimensional circuit carriers) as a service in Magdeburg. 3D-MID stands for Mechatronic Integrated Device (or Molded Interconnected Devices). The MID technology makes it possible to use three-dimensional plastic parts as circuit carriers for electronic or mechatronic assemblies. The LPKF-LDS process is one of the technologically leading and at the same time most economically interesting process for the production of 3D-MID. The LPKF LDS process represents the central process step. The process was developed and patented by the company LPKF Laser & Electronics AG in Hanover.