Laser cutting - Import export

Baking varnish is a special joining technology for sheet metal packages. After the individual lamellas have been cut, electrical steel with a baking varnish coating is baked into a sheet metal package in a two-stage temperature step. The result is a full-surface, solid connection between the individual sheets with complete insulation. Sheet metal packages manufactured in this way have high precision and perfect magnetic properties. Advantages of the Backlack process: The Backlack process offers several advantages over alternative packaging processes, which we will discuss in detail below. Precision – Sheets coated with baking varnish are baked over the entire surface. This means that even delicate slats can be assembled precisely.

TEPROSA GmbH has specialized for many years in the manufacture of sophisticated, precisely fitting laminated cores of exceptionally high quality. In the field of electrical steel sheet, we manufacture individual laminations and sheets for stators and rotors, as well as entire sheet packages stator- or rotor packages) from various steel grades. We process grain oriented electrical steel for generators, transformers and other electrical machinery. Our most common method for packaging the individual laminations is baked enamel technology. Alternatives are welding or bolting of laminations. As a long-standing supplier to various OEMs, the quality of our work is particularly important to us. Therefore, we work according to uniform processes and thus ensure consistent quality and complete traceability of each individual production step.

We offer our customers laser cutting of fine and thin sheets, as well as laser fine cutting of materials with very low material thicknesses (0.02 mm – 4.00 mm) as contract manufacturing. Of course we manufacture from the first sample and also up to mass production. If you do not know whether your material is suitable for processing with the laser, we will be happy to find out for you and provide you with a first demonstration sample free of charge.

Use our online inquiry form to place your request through our website at any time without any additional effort. Simply upload your manufacturing data to our server and deposit the material you require.

We are specialist in strain gage strain measurements on printed circuit boards and all other components. We carry out the application of strain gages and determine for you the actual stresses that occur, or the strain (also strain-rate) on a specific or several components in the manufacturing or assembly process. We perform our DMS measurements with certified measurement technology and according to the specifications of IPC/JEDEC-9704A. Expert advice from TEPROSA When measuring strain, in addition to many factors such as the appropriate measurement technology, it is also important to rperform the strain measurement correctly and to ensure that the sensors record the forces correctly. To ensure that the deformation of an object is correctly determined, it is therefore crucial to select the right strain gauges (also known as measuring strips) and to place them in the correct position on the measured object.

In an environmental simulation, assemblies are subjected to defined environmental conditions to validate their behavior under those conditions. The variables of an environmental simulation test include climatic aspects such as temperature (cold, heat), the air conditions (humidity, wetness), mechanical influences such as dust, vibration, vibration or impacts, and corrosive environmental effects such as salty lift (salt fog). As an environmental simulation laboratory, we simulate these environmental conditions in our climatic chambers and climatic chambers, creating real conditions to investigate the long-term behavior of the test specimens in reality. Environmental simulation and thermal shock testing laboratory for electronic assemblies and printed circuit boards We specialize in performing environmental simulation and temperature shock testing of electronic and mechanical assemblies. With over ten years of experience with the requirements of the automotive industry and medical

Testing services from a specialist: we are specialized as a testing laboratory for the simulation of specific environmental conditions and the monitoring of the influences of these conditions on electronic assemblies. We offer the following services in our test lab and at your site as contract testing.

Mechatronic integrated devices or molded interconnect devices (injection-molded circuit carriers) are spatial electronic assemblies – so-called 3D-MID. A special process is used to apply metallic conductor tracks to a specific substrate material (often plastic), thus creating three-dimensional assemblies that also serve as circuit carriers. These spatial electronic assemblies are manufactured using 3D-MID technology and, compared to conventional assemblies, enable the integration of electronic, mechanical, fluidic, optical and thermal functions. The resulting additional benefits represent advantages that cannot be realized with two-dimensional circuit carriers (printed circuit boards).

With the help of the 3D-MID process, plastic parts can be metallized not only over the entire surface, but also selectively. To do this, the plastic part is activated with a special laser at the points that are to be coated (this is referred to as laser activation or laser direct structuring). The additives contained in the plastic directly under the plastic surface are “exposed” by the laser treatment. In a chemical bath, copper particles can then be deposited specifically only on the activated surfaces. Other metals, e.g. nickel, tin or gold, can then be deposited onto the starting layer of copper. In this way, a selectively coated plastic part is obtained. MID technology thereby makes it possible to selectively coat two-dimensional and also three-dimensional plastic parts and use them, for example, as circuit carriers for electronic or mechatronic assemblies. With the LPKF-LDS process

We offer laser direct structuring (LPKF-LDS process) for the production of 3D-MID (so-called three-dimensional circuit carriers) as a service in Magdeburg. 3D-MID stands for Mechatronic Integrated Device (or Molded Interconnected Devices). The MID technology makes it possible to use three-dimensional plastic parts as circuit carriers for electronic or mechatronic assemblies. The LPKF-LDS process is one of the technologically leading and at the same time most economically interesting process for the production of 3D-MID. The LPKF LDS process represents the central process step. The process was developed and patented by the company LPKF Laser & Electronics AG in Hanover.

3D-MID are three-dimensional, spatial circuit carriers. The abbreviation MID stands for Molded Interconnect Device, or also for Mechatronic Integrated Devices. The term extension Mechatronic Integrated Devices as opposed to Molded Interconnect Devices (origin Molded = injection molded) is increasingly being used, since the three-dimensional basic bodies are no longer manufactured exclusively through the use of injection molding technology and no longer exclusively from plastic.

Select the material, the quantity and the sheet thickness. If you already have a technical drawing, you can upload it to our server. Wwe only need your contact details to send you an individual offer for laser cutting contract manufacturing! If you need several lamellas, you can simply send off the order form several times.

Shims, or shims sheets / spacer sheets / shims, are used to compensate for tolerances that occur in manufacturing. In this way, components and products in fixture construction, on machines and in automobiles can be compensated for easily, cost-effectively and with high precision.

Laser drilling is a non-chipping drilling technique for producing fine holes in various materials and material thicknesses. Through the targeted use of pulsed laser radiation, the finest drillings in the micrometer range can be realized at high speed. We offer percussion drilling and single pulse drilling, two precise drilling methods for many applications.