Semiconductor - Import export

Excellent performance with porous vacuum componets Manufacturers around the world trust our porous materials to deliver excellent performance when used as vacuum components. Anti-static additives can also be introduced for applications that require conductivity. Ensure purity–Material is backed by the Certified Pure POREX™ program of independent laboratory testing of leachables, extractables and interfering substances. Deliver precise flow rates and tolerances–Engineered for tight pore size and volume control. Improve device effectiveness–Design is customizable per application and can incorporate anti-static properties. request sample ask an engineer

Enhance semiconductor processing with pure materials Our high-purity diffusion tubes allow semiconductor processing facilities a precise way to diffuse, filter and distribute process gases. Specifically designed to precise flow and dimensional tolerances, POREX® diffusion tubes: Ensure purity –Material is backed by the Certified Pure POREX™ program of independent laboratory testing of leachables, extractables and interfering substances. Deliver precise flow rates and tolerances–Engineered for tight pore size and volume control. Improve process effectiveness–Design is customizable per application requirements. request sample ask an engineer

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.