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Riga Form Birch plywood ( Riga Ply) bonded with waterproof phenol resin adhesive and overlaid on both the faces with a phenol film or with UV resistant film (grade F/F). Film colour Dark brown (120, 130 (wear resistant), 167 and 220 g/m 2) Light brown (120 g/m 2) Yellow non - transparent (167 g/m 2) Green (120 g/m 2) Black (120 g/m 2) Red (220 g/m 2) Honey (120 g/m 2) Opal white (UV resistant, 174 g/m 2) Grey (UV resistant, 174 g/m 2) Titanium Grey (amino film, 220 g/m 2) Blue (UV resistant, 200 g/m 2) Our specialists will advise the most appropriate overlay depending on end use and film availability. Advantages Environmentally friendly, durable, easily workable, hygienic, odour free, easy-to-clean, wear-resistant, weather- and water-proof, resists commonly used chemicals. Riga Form for shuttering can be re-used many times. Application Shuttering (dark brown, red films), transport industry, building and construction, flooring, inter-wall structures in farms, advertisement and information panels. Sizes 1220 mm x 2440 / 3050 mm 1250 mm x 2500 / 3000 mm 1500 mm x 2500 / 3000 mm 1525 mm x 3050 / 3660 mm 2150 mm x 3050 / 3340 / 3850 mm Cut-to-size panels and machined panels available in accordance with the customers' requirements. Thicknesses 4, 6.5, 9, 12, 15, 18, 21, 24, 27, 30, 35, 40, 45, 50 mm.

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.