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Germany
Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material
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3DMicromac‘s microSTRUCT™ C is a highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the system ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin film compound systems. The microSTRUCT™ C offers a maximal degree of freedom regarding the positioning of the substrates. Flexible, stable and repeatable machining results Two independent and free configurable working areas with various optical setups Open system concept for the integration of different laser sources High range of software functions (Masterscript) User friendly, flexible, upgradeable system
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