Laser - cutting and welding machines - Import export

We offer our customers laser cutting of fine and thin sheets, as well as laser fine cutting of materials with very low material thicknesses (0.02 mm – 4.00 mm) as contract manufacturing. Of course we manufacture from the first sample and also up to mass production. If you do not know whether your material is suitable for processing with the laser, we will be happy to find out for you and provide you with a first demonstration sample free of charge.

Use our online inquiry form to place your request through our website at any time without any additional effort. Simply upload your manufacturing data to our server and deposit the material you require.

Baking varnish is a special joining technology for sheet metal packages. After the individual lamellas have been cut, electrical steel with a baking varnish coating is baked into a sheet metal package in a two-stage temperature step. The result is a full-surface, solid connection between the individual sheets with complete insulation. Sheet metal packages manufactured in this way have high precision and perfect magnetic properties. Advantages of the Backlack process: The Backlack process offers several advantages over alternative packaging processes, which we will discuss in detail below. Precision – Sheets coated with baking varnish are baked over the entire surface. This means that even delicate slats can be assembled precisely.

We are specialized in performing thermal shock testing of electronic and mechanical assemblies and have a lot of experience with the requirements of the automotive industry and medical technology. On behalf of our customers, we perform environmental and climatic tests according to customer specifications and applicable standards, thus uncovering optimization potential. We will be happy to advise you with regard to your testing tasks and, together with you, transfer the entire testing process into a specification sheet. OUR OPPORTUNITIES 2-chamber system air-air Test chamber volume up to 130 liters Temperature range hot chamber 50°C to 200°C Temperature range cold chamber -80°C to -100°C Change between chambers <15 seconds Maximum test material weight 25 kg State monitoring of the test specimens during the test

In an environmental simulation, assemblies are subjected to defined environmental conditions to validate their behavior under those conditions. The variables of an environmental simulation test include climatic aspects such as temperature (cold, heat), the air conditions (humidity, wetness), mechanical influences such as dust, vibration, vibration or impacts, and corrosive environmental effects such as salty lift (salt fog). As an environmental simulation laboratory, we simulate these environmental conditions in our climatic chambers and climatic chambers, creating real conditions to investigate the long-term behavior of the test specimens in reality. Environmental simulation and thermal shock testing laboratory for electronic assemblies and printed circuit boards We specialize in performing environmental simulation and temperature shock testing of electronic and mechanical assemblies. With over ten years of experience with the requirements of the automotive industry and medical

We are specialist in strain gage strain measurements on printed circuit boards and all other components. We carry out the application of strain gages and determine for you the actual stresses that occur, or the strain (also strain-rate) on a specific or several components in the manufacturing or assembly process. We perform our DMS measurements with certified measurement technology and according to the specifications of IPC/JEDEC-9704A. Expert advice from TEPROSA When measuring strain, in addition to many factors such as the appropriate measurement technology, it is also important to rperform the strain measurement correctly and to ensure that the sensors record the forces correctly. To ensure that the deformation of an object is correctly determined, it is therefore crucial to select the right strain gauges (also known as measuring strips) and to place them in the correct position on the measured object.

Testing services from a specialist: we are specialized as a testing laboratory for the simulation of specific environmental conditions and the monitoring of the influences of these conditions on electronic assemblies. We offer the following services in our test lab and at your site as contract testing.

Mechatronic integrated devices or molded interconnect devices (injection-molded circuit carriers) are spatial electronic assemblies – so-called 3D-MID. A special process is used to apply metallic conductor tracks to a specific substrate material (often plastic), thus creating three-dimensional assemblies that also serve as circuit carriers. These spatial electronic assemblies are manufactured using 3D-MID technology and, compared to conventional assemblies, enable the integration of electronic, mechanical, fluidic, optical and thermal functions. The resulting additional benefits represent advantages that cannot be realized with two-dimensional circuit carriers (printed circuit boards).

With the help of the 3D-MID process, plastic parts can be metallized not only over the entire surface, but also selectively. To do this, the plastic part is activated with a special laser at the points that are to be coated (this is referred to as laser activation or laser direct structuring). The additives contained in the plastic directly under the plastic surface are “exposed” by the laser treatment. In a chemical bath, copper particles can then be deposited specifically only on the activated surfaces. Other metals, e.g. nickel, tin or gold, can then be deposited onto the starting layer of copper. In this way, a selectively coated plastic part is obtained. MID technology thereby makes it possible to selectively coat two-dimensional and also three-dimensional plastic parts and use them, for example, as circuit carriers for electronic or mechatronic assemblies. With the LPKF-LDS process

We offer laser direct structuring (LPKF-LDS process) for the production of 3D-MID (so-called three-dimensional circuit carriers) as a service in Magdeburg. 3D-MID stands for Mechatronic Integrated Device (or Molded Interconnected Devices). The MID technology makes it possible to use three-dimensional plastic parts as circuit carriers for electronic or mechatronic assemblies. The LPKF-LDS process is one of the technologically leading and at the same time most economically interesting process for the production of 3D-MID. The LPKF LDS process represents the central process step. The process was developed and patented by the company LPKF Laser & Electronics AG in Hanover.

3D-MID are three-dimensional, spatial circuit carriers. The abbreviation MID stands for Molded Interconnect Device, or also for Mechatronic Integrated Devices. The term extension Mechatronic Integrated Devices as opposed to Molded Interconnect Devices (origin Molded = injection molded) is increasingly being used, since the three-dimensional basic bodies are no longer manufactured exclusively through the use of injection molding technology and no longer exclusively from plastic.

Select the material, the quantity and the sheet thickness. If you already have a technical drawing, you can upload it to our server. Wwe only need your contact details to send you an individual offer for laser cutting contract manufacturing! If you need several lamellas, you can simply send off the order form several times.

Shims, or shims sheets / spacer sheets / shims, are used to compensate for tolerances that occur in manufacturing. In this way, components and products in fixture construction, on machines and in automobiles can be compensated for easily, cost-effectively and with high precision.

Laser drilling is a non-chipping drilling technique for producing fine holes in various materials and material thicknesses. Through the targeted use of pulsed laser radiation, the finest drillings in the micrometer range can be realized at high speed. We offer percussion drilling and single pulse drilling, two precise drilling methods for many applications.

TEPROSA GmbH has specialized for many years in the manufacture of sophisticated, precisely fitting laminated cores of exceptionally high quality. In the field of electrical steel sheet, we manufacture individual laminations and sheets for stators and rotors, as well as entire sheet packages stator- or rotor packages) from various steel grades. We process grain oriented electrical steel for generators, transformers and other electrical machinery. Our most common method for packaging the individual laminations is baked enamel technology. Alternatives are welding or bolting of laminations. As a long-standing supplier to various OEMs, the quality of our work is particularly important to us. Therefore, we work according to uniform processes and thus ensure consistent quality and complete traceability of each individual production step.

Stainless steel system for cleanroom production with 400 W laser system Positioning the laser head using a 3-axis servo system Stainless steel lifting door with inspection window.

Removal of determined locking ring class (double removal) with control measurement and transfer to assembly station Locking ring assembly and testing (cycle time approx. 30 sec.)

Axial bearing 1000 N press, locking ring assembly and testing station

Stainless steel system for cleanroom production with 400 W laser system Positioning the laser head using a 3-axis servo system Stainless steel lifting door with inspection window

Differential assembly with torque and angle monitoring Positioning the 5 screwing units to screw in 2 x 5 screws in succession

Test OK or NOK. Locking ring assembly over envelope circle

Handling the friction and steel discs into the measuring system from storage 360° laser measurement of the thickness of friction and steel discs Stacking discs with the respective high points offset to each other Measuring the disc pack for stacking height (pack class) and plane parallelism

FIFO disc magazine and control measurement device

Fast cycling assembly machine 10 stations with O-ring assembly. Cycle time 1.7 sec.

Measuring groove widths for selecting locking ring classes

Measuring machine for determining discs axial gearing DL501

Measuring machine for determining discs double clutch DQ381

Adaptive optics is a special form of high-performance laser mirrors. Their characteristic is that the mirror surface is designed as a membrane, which can be deformed in a controlled manner by pressure change on its back. The shape errors occurring in this case are extremely low; we tolerate them with a maximum of 0.0005 mm. Our adaptive optics are suitable for use with laser power up to 10 KW thanks to integrated direct water cooling and HR coating. Most common types are the adaptive optics with elliptical membrane as these can be used directly to the 90 ° deflection. They are identical to our standard planes of identical aperture and therefore do not need special housings. In addition to the elliptical varieties, LT Ultra also offers round adaptive mirrors. As a rule, these replace the concave spherical mirror of an existing telescopic beam expander directly at the resonator. Round adaptive mirrors can only be used with deflections <10 °. …