Ceramic substrate - Import export

Laser ablation technology helps the engineer to develop circuit carriers which cannot be manufactured with chemical etching technology. This kind of product results from combining the technologies of precision-grinding of ceramics and laser ablation of metallised thin-film layers. We name this concept "three-dimensional interconnection circuit or CI3D". Principle The laser structuring consist to etch directly a metallization layer deposited on a ceramic carrier with a laser beam without using a mask. This is called laser micromachining or laser ablation - because metal is ablated. Laser ablation allows patterns to be etched directly on the ceramics substrate, very rapidly and beam displacements to be programmed limitless. Equipment Solid-state lasers are mostly used for micromachining applications because they feature precision, speed and selective etching. We currently use a Nd :YAG laser with 60 W output. It enables us to etch thin-film metallised layers with thickness of up...

Microelectronic circuits continuously require new packaging technologies. Ceramic substrates are widely used in this field for their good dimension stability, high electrical insulation as well as their resistance to high temperature. But it is now possible to create microelectronic circuits on 3D carriers made with ceramics. This new type of component integrates electrical and mechanical functions on a same carrier, which gives a wider scope in terms of design and integration. Microcertec has developped a unique expertise to manufacture these ceramic 3D interconnection devices - CI3D - based upon high-precision ceramic grinding of a 3D carrier, thin-film metallizing and laser etching. These 3D interconnect carriers demonstrate the advantages of being made with advanced ceramics but they also offer miniaturization capabilities, enhanced reliability and more simple integration stages. In actual fact, the geometry of the carriers offers a 3D arrangement so that microelectronic...