Finned heat sinks - Import export

For forced cooling, Seifert electronic offers compact fan units in various performance classes. The variable fin spacing in the high-performance heat sinks ensures strong cooling during fan operation. In forced convection cooling, fans are required as separate sources of convection. To ensure optimal convection during fan operation, it is recommended to incorporate heat sink profiles. The fin spacing in heat sink profiles is particularly important, as increasing the surface area is key for forced cooling. To push this boundary further, we have continuously reduced the fin spacing in our profiles. Depending on the model, up to three fans per cooler are possible, which can optionally be equipped with pressure chambers for improved air guidance. Most heat sinks are already equipped with aerodynamically designed hollow fins. Additionally, air deflectors for air guidance are available for some heat sink profiles.

High-performance heat sinks from Seifert electronic are exclusively designed for forced cooling applications. The powerful heat sinks from the Vario and DKL series impress with their large cooling surfaces. Utilizing a finned construction, rib spacing can be manufactured that is not achievable with conventional extruded profiles. Thanks to maximized surface area with the same weight, a high-performance heat sink delivers above-average cooling performance per unit volume. We have patented our proprietary compression geometry at Seifert electronic. In this process, individual fins are precisely cold-pressed into a heat sink without the use of adhesives. Heat conduction in the finned heat sinks occurs directly from the base to the fins, without any thermal transition as seen with pressed-in ribs into a solid base. Custom mounting holes can be incorporated into the pressed, surface-milled base.

Seifert heat sinks are designed for both natural and forced cooling applications. From standard heat sinks to individually machined custom profiles, we offer the appropriate heat sink in the desired profile. The standard heat sinks from Seifert electronic GmbH are classic finned heat sinks, primarily intended for natural cooling. However, these heat sinks can also be utilized for forced cooling with airflow. Thanks to the extensive variety of profiles in our standard range, we can fulfill almost any heat sink requirement. From small transistor coolers to profile giants for IGBT cooling, measuring up to 900 mm in width, we provide the right profile for nearly every application. In addition to our standard profiles, we have access to open profiles, offering the possibility of further variations without incurring tooling costs.

SEPA EUROPE offers a 40 mm frameless fan especially for embedded systems. It is 10 mm high and provides a compact solution for chip cooling when used in combination with the appropriate heat sink. In addition to the 50 mm frameless fan which is already on the market, the new round 40 mm fan is also a much sought-after model for embedded systems. This is because many standard cooling solutions in this business sector are based on the 40 x 10 mm fan. Strictly speaking, the 40 mm fan has a rotor diameter of 37 mm. The version offered by SEPA EUROPE is equipped with two ball bearings and can boast a remarkable service life of 70.000 h at a temperature of 40°C. In addition to an impulse output for speed monitoring, it also has a PWM input for speed setting in the range of approx. 35 – 100% of the nominal speed. In conjunction with the power block pin-fin heat sink, this virtually silent fan with 22 dB(A) is also available ready for connection in the „Kühligel“ version.

ETC Source Four PARNel , black With its patent-pending wave lens design and easy spot to flood adjustment knob, the PARNel CE lets you quickly access a range of 25 to 45 degrees - a smooth, soft, symmetrical fiels that you can spot or flood like a fresnel. Super-efficient HPL Lamp, Die-cast aluminium contruction. Features Enhanced Aluminium Reflector Die-cast faceted feflector One fixed wave clear lens and one rotatable mwave stippled lens installed tool free front lens changing thermally insulated, prcision focus knob sealed reflector housing reflector temperature control through integral heat sink fins integral die cast colour frame / accessory holders and top mounted retainer positive locking yoke clutch HPL max. 750W beam: 25° - 45° available weight: 3,6kg

Schultze RiRo heaters are your solution for industrial and commercial heating appliances: dust- and watertight, corrosion-resistant, flexible and uncomplicated to install. Suitable for damp locations and rough industry environment, for reliable and efficient heating – often unnoticed, but indispensable. With the built-in three step switch heating power can be adjusted according to actual requirements. This helps saving energy! Step I 1/3 of heating power Step II 2/3 of heating power Step III 3/3 of heating power

Schultze RiRo heaters are your solution for industrial and commercial heating appliances: dust- and watertight, corrosion-resistant, flexible and uncomplicated to install. Suitable for damp locations and rough industry environment, for reliable and efficient heating – often unnoticed, but indispensable. RiRo-F for rooms with fire risk: the economic choice for rooms where a “full range” heating is not needed, e.g. to protect your rooms or your valuable facilities against frost. To keep below the reduced surface temperature of 115°C we chose appropriate power layout. Max. 115°C on top of the fins.

We specialize in engineering high quality composites for management of heat in electronics packages, particularly Integrated Circuit (IC) packaging. These composite materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC). Turnkey Solution for Production Ready Pedestals Our advanced thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging. Sizes Our heat spreader materials for IC packages are offered in a wide breadth of sizes including: Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm) Down to finished machined and plated products in 0.015” (0.381mm) cubes Hermetic Housings and Heat Sinks These thermal management products are used as both the hermetic housings and as the expansion-matched