Thermally conductive ceramics - Import export

The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is widely used in communication components, high power led, power electronic devices and other fields.Special spec products can be produced upon requests. Product Features： 1.Uniform microstructure 2.High thermal conductivity* (70-180 Wm-1K-1), tailored via processing conditions and additives 3.High electrical resistivity 4.Thermal expansion coefficient close to that of Silicon 5.Resistance to corrosion and erosion 6.Excellent thermal shock resistance 7.Chemically stable up to 980°C in H2 and CO2 atmospheres, and in air up to 1380°C (surface oxidation occurs around 780°C; the surface layer protects the bulk up to 1380°C).

INNOVACERA is good at yttria stabilized zirconia. Unlike other ceramic materials, zirconia is a material with very high resistance to crack propagation. Zirconium oxide ceramics also have very high thermal expansion and are therefore often the material of choice for joining ceramic and steel. Features: > high fracture toughness > thermal expansion similar to cast iron > extremely high bending strength and tensile strength > high resistance to wear and to corrosion > low thermal conductivity Ceramic material composition: . TTZ: Magnesia partially stabilized Zirconia (ZrO2) · YTZP: Yttria partially stabilized Zirconia (ZrO2) · ZDY: Yttria fully stabilized Zirconia (ZrO2)

With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components.

Aluminum nitride ceramics have excellent electrical and thermal properties, and are considered to be the most promising high thermal conductivity ceramic substrate materials. In order to seal the package structure, mount components and connect input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metallized. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrates, and firm bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also required to have high thermal conductivity at the interface between the metal and the ceramic. The metallization methods on the surface of aluminum nitride ceramics include: thin film method, thick film method, high melting point metallization method, electroless plating method, direct copper cladding method (DBC), etc.

Alumina Ceramic Cavity Laser Reflectors Introductions : High purity porous alumina ceramic of 99% Al2O3 content, used extensively for long-life laser reflectors. This material is sintered at high temperatures to achieve a controlled porosity. Ceramic Reflector Prime Features: > Surfaces can be sealed and coated with a solarization-resistant glaze to give high bulk refectivity > 97% reflectance efficiency at 600-1000nm > Reflectance efficiency exceeds 95% across the wavelength range 400-1200nm (see curve) > Controlled porosity > Good thermal conductivity > High electrical resistivity Ceramic Cavity Laser Reflectors Physical properties: > Color: White > Bulk density (fired), Mg/m3 :3.1 > Porosity (apparent), % nominal :22 > Flexural strength (ASTM C1161, 3-point), MPa :170 > Thermal expansion coefficient 200-500C, 10-6 /C 7.9 200-1000C, 10-6 /C 9.0

Form: Granule; Feature: Heat Insulation and Low Thermal Conductivity; Application: Extrusion & Injection Moulding; Customized: Yes and contact for material solution.