Corrosion resistant metals - Import export

Aluminum Nitride (AIN) materials play a important roles in the semiconductor industry, the similarities between its thermal profile and that of silicon has made an ideal choice for wafer-related semiconductor applications. Innovacera’s Aluminum nitride wafers have high reliability of Si chip and thermal heat cycling. According to direct wafer bonding technology, polished semiconductor wafers can be bonded together without adhesives. Direct wafer bonding requires very flat and high smooth surface (Ra≤0.05um), Innovacera AlN wafers substrate can meet this requirements. Features High melting point High electrical insulation Lowdielectric constant Higher mechanical strength Superior corrosion resistance against molten metal Thermal and chemicalstability High thermal conductivity (170-220w/mk) Similar coefficient of thermal expansion to that of silicon (si)

BN is a material with non-wet feature. So molten metal won’t be sticked onto the nozzle. Additionally, Boron Nitride ceramic is a kind of refractory ceramic with low expansion and high thermal conductivity. These features make it to be an ideal choice as atomizing nozzles. It's very easy to be machined to custom design with precision and tight tolerance because of its machinability. Boron Nitride Ceramic BN Nozzles Performance: 1.The optimized formula and unigque process make it highly resistant to thermal shock and high-temperature creep.Maximum using temperature 1700°C. 2.Low thermal expansion coefficient,no cracking or deformation during use. 3.Strong erosion resistance,wear resistance and metal corrosion resitance.Long service life. 4.Good raw materials,process control,product stability. 5. It is used in Amorphous Ribbon Making and amorphous nozzles.

The protective tube of silicon nitride material has high thermal conductivity, high temperature resistance, corrosion resistance,non-wetting with molten metal, and electrical insulation, making it the best choice for heating body protection tubes. The advantage of the immersion holding furnace is very obvious, and in order to achieve the immersion of the heating element into the molten metal, it is necessary to have a protective tube which can protect the heating element well. Silicon Nitride (Si3N4) Characteristics: 1 Good thermal shock resistance 2 Creep resistance 3 Low density 4 High fracture toughness 5 High hardness and wear resistance 6 Electrical resistivity

BN-AlN Ceramic is made by sintering Boron Nitride (BN) and Aluminum Nitride (AIN) powder. It has excellent electrical insulator, thermal conductivity, high strength, resistance to thermal shock, and strong resistance to halogen gas plasma, which is offers a wide range of applications, including components for semiconductor production equipment and components that require effective heat dissipation. The ion source is a device that creates atomic and molecular ions, which is in the vacuum chamber. Aluminum Nitride/Boron Nitride Composite has excellent electrical insulator, thermal conductivity, sealing ability to vacuum and hasn’t given off much gas. So it is plays an heat sinks and thermal transfer plate role in ion sources. Material Advantages: High mechanical strength. High thermal conductivity. Low thermal expansion. Low dielectric loss. Excellent electrical insulation. High corrosion resistance–non-wetted by molten metals.