Copper foils - Import export

Luminance efficiency Max up to 220LM/W Self-encapsulated design offers 4 optional 2700-6500K white lights With life span over 60000H NA/SG/ET/EF/EG IP process

Product Name: Brass Strips Coil Foil for Decoration Application: Electronic, telecommunications Width: 3mm-1220mm Material: Brass Grade: Brass Coil Cu (Min): 64.0-68.0% Model Number: C2680,C2680,C2700.etc. Place of Origin:  China Processing Service: Bending, Welding, Decoiling, Cutting, Punching Shape: Strip Coil Roll Temper: O, 1/4H, 1/2H, 3/4H, H, EH, SH Alloy brand: C2680, C2600, etc Standard: JIS ASTM DIN EN ISO Surface: Mill,Polish,Bright,Hair line,Brushed,etc. Package Type: Standard export seaworthy package,or as required. Payment term: T/T,L/C etc. Port of shipment:Xiamen,China Lead time:15-30days

width 100mm thick 0.02mm

Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid

DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)