Electrical insulation - Import export

Starting with the base polymer TECASINT 5011, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 340°C, while the maximum service temperature may be – for a short time – up to 300 °C.

The unfilled grade TECASINT 5111 natural is based on the high-performance plastic polyimide, which is characterised by its very good thermal stability with low thermal expansion. Polyimides are non-melting polymers with a service temperature of 300 °C, which is considerably higher than that of PEEK or PPS. In addition, TECASINT 5111 natural has a high creep resistance. These properties makes PI plastic ideal for applications where high temperature resistance is required, such as in the aerospace industry. TECASINT 5111 natural has good chemical resistance, especially to light acids and many organic solvents. In combination with the very good electrical insulating properties of the PI material, TECASINT 5111 natural is also perfectly suited for applications in the semiconductor industry, electrical engineering or mechanical engineering. Moreover, the polyimide material has good mechanical properties, good wear resistance and is also resistant to high-energy radiation.