Tecasint 5051

Polyimide 5000 series 30% glass fibre

Description

Starting with the base polymer TECASINT 5011, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 340°C, while the maximum service temperature may be – for a short time – up to 300 °C.

  • Thermal insulation materials
  • Polyimide
  • Torlon 5530
  • Duratron 5530

Domain icon Manufacturer/ Producer

4863 Seewalchen - Austria

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