wafer bonding

... be bonded together without adhesives. Direct wafer bonding requires very flat and high smooth surface (Ra≤0.05um), Innovacera AlN wafers substrate can meet this requirements. Features High melting point High electrical insulation Lowdielectric constant Higher mechanical strength Superior corrosion resistance against molten metal Thermal and chemicalstability High thermal conductivity (170-220w/mk) Similar coefficient of thermal expansion to that of silicon (si)...

...This technology platform enables the structuring of thin membranes based on silicon wafers or SOI wafers, also using wafer bonding techniques. The membranes can consist of various thin layers or layer stacks. Established material systems include membrane materials such as Si, SiO2, Si3N4, AlN, and graphene, as well as electrode materials like Al, Au, Pt, and metallic glass. After assembly, the...

...In the transponder assembly line TAL, transponder chips are placed and contacted through structural adhesive bonding. The unpopulated transponders are loaded from the packaging conveyor into transport magazines. Subsequently, a dosing system applies an precisely measured amount of adhesive to the unpopulated transponders, and the chips are placed from the wafer onto the connection surfaces. The fully assembled transponders are then cured and measured.

... significant advantage of technical ceramics is their high electrical insulation even at elevated temperatures. Application areas include, for example, sensors in ship engines (thin wire bonding), precursor gas distribution rings in wafer coating (PE-ALD), or small thrusters for satellites. Here, ceramic composite components enable the realization of the application. In addition to standard...

...ceramic, or composite bonding material). A Dental implant is an artificial root, or titanium fitting, that is surgically secured to the jawbone. The light and durable metal implant acts as an anchor for a false tooth or set of false teeth. Dental Centre Turkey...

Die bonders for assembly and interconnection technology; wafer inkers and wafer inspection; development of special equipment; automatic optical lens characterization. Research and development focuses: assembly and interconnection technology with accuracies up to 1 µm @ 3 Sigma; wafer inking; optical measurement technology. Current cutting-edge technologies: die bonding with 1 µm accuracy.