Plastic compounds - Import export

Product Features: • Designed for EMI/RFI shielding applications - using conductive plastic (a compound of plastic and stainless steel fibers). • Electronic instrument enclosures, ideally suited for mounting printed circuit boards. • Thick wall design with an average wall thickness of 0.13" (3.3mm). • Moulded from a compound of stainless steel fibers and flame retardant ABS plastic (carries a UL flammability rating of 94V-0). • Designed to meet IP54. • Note: Material is brittle - acts like phenolic - Not for high impact use. • Countersunk lid is secured with four M3 x 0.5 - 0.71" (18mm) long, Philips machine screws threaded into integral brass bushings. Perfect for applications with repetitive assembly and disassembly are required. • Black with matte textured finish.

Product Features: • Designed for EMI/RFI shielding applications - using conductive plastic (a compound of plastic and stainless steel fibers). • Attractively styled and ergonomically designed for use as a "Hand-Held" instrument enclosure. • Moulded from a compound of stainless steel fibers and flame retardant ABS plastic (material carries a UL flammability rating of 94V-0). • Recessed top for membrane display or pad. • Lap joint construction provides protection against dust accumulation and splashing water. • Extra deep top and ultra shallow base are specifically designed to enhanced the aesthetics of the enclosure and provide the user with flexibility and assembly efficiency. • Designed to meet IP54. • Note: Material is brittle - acts like phenolic - Not for high impact use. • Lid is secured with Philips machine screws, threaded into tapped integral brass bushings. Perfect for applications with repetitive assembly and disassembly are required.