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Our advanced systems ensure a continuous electronic exchange of information with customers over the INTERNET. Thanks to the GENESIS 2000 software, the technical information from the customers is converted into production patterns accurately and quickly, and the films are produced with printers to be used in the production stages.
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Laser cut stainless steel sieve, phosphorus-bronze, adhesive sieve Plate thicknesses: 80μ, 100μ, 120μ, 150μ, 200μ
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Turkey
Maintaining a dust-free environment is one of our top priorities, as it eliminates the possibility of any errors that may occur during the printing process.
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Due to the fact that punching and cutting processes are performed with molds in single-sided printed circuit board production, our company has established its own mold production facility. Printed circuit information from customers is converted into a format suitable for mold production machines in the CAD/CAM work preparation center and transmitted to the mold center via the local computer network. In this center, necessary mold drawings are made using this information, and molds are produced quickly and precisely on state-of-the-art machines.
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Organic Surface Coating, which is one of the latest technologies among the surface treatment alternatives offered to the customer, ensures that all elements can be soldered well and a flat surface is obtained for proper adhesion of SMD elements to the printed circuit.
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