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The wireless IST AG FlipChip series features Pt temperature sensors with excellent long-term stability, fast response time and low self-heating. The FlipChips are developed with contacts on one side resulting in no short-cut risk on the backside of the chip. Furthermore, IST AG offers different FC technologies for different assembly processes (reflow-soldering, bonding or welding). The FC sensors are available with accuracies of up to IEC 60751 F0.3 (IST AG reference class B) and in different dimensions (0603/0805/1206/further dimensions on request) with other dimensions available on request. The FC sensors are optimal for applications with limited space requirements and offer an optimal price/performance ratio. Due to the small mechanical dimensions, a standard 0805 FC will use the same space as a standard 0603 SMD sensor on a PCB.​

The wireless IST AG FlipChip series features Pt temperature sensors with excellent long-term stability, fast response time and low self-heating. The FlipChips are developed with contacts on one side resulting in no short-cut risk on the backside of the chip. Furthermore, IST AG offers different FC technologies for different assembly processes (reflow-soldering, bonding or welding). The FC sensors are available with accuracies of up to IEC 60751 F0.3 (IST AG reference class B) and in different dimensions (0603/0805/1206/further dimensions on request) with other dimensions available on request. The FC sensors are optimal for applications with limited space requirements and offer an optimal price/performance ratio. Due to the small mechanical dimensions, a standard 0805 FC will use the same space as a standard 0603 SMD sensor on a PCB.​