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The IST AG 200 °C Ni Temperature Sensor Series offers an excellent long-term stability and simple linearization within a temperature range of -60 °C to +200 °C.​ The sensors are offered with Ag-wire (Ø 0.25 mm), with Au-coated Ni-wire or flat wire and with Cu/Ag-wire with PTFE-insulation in various standard lengths. The directly welded wires offer outstanding robustness and are optimal for soldering, welding and crimping. The nickel temperature sensors are vibration and temperature shock resistant with simple interchangeability and small dimensions. Furthermore, the 200 °C Ni Temperature Sensor Series can be customized to fit application-specific requirements. ​The IST AG nickel temperature sensors up to 200 °C are also available with: — Wire lengths fitted to application-specific requirements — Insulated wires — Flat wires — Metallized backside

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

Bondable platinum 1000 Ohm RTD component Nominal resistance 1000 Ω at 0 °C Operating temperature range —50 °C to +150 °C TCR Pt 3850 ppm/K Chip size/dimensions 0.75 x 0.75 x 0.3 mm Tolerance/class IEC 60751 F0.3 (IST AG tolerance class B) Connection type Bondable pads (Au) Packaging Chip tray, sensor-side up

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.